Suction nozzle structure for semiconductor flip chip manufacturing process
The utility model relates to a suction nozzle structure for a semiconductor flip chip process, which comprises a suction nozzle integrally formed by a hard alloy material, a gas channel is formed in the suction nozzle, the suction nozzle is provided with an adsorption end and an assembly end which a...
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| creator | LI WENXUE WANG JIAN WEI DONG ZHU LIHAI ZHANG LYU |
| description | The utility model relates to a suction nozzle structure for a semiconductor flip chip process, which comprises a suction nozzle integrally formed by a hard alloy material, a gas channel is formed in the suction nozzle, the suction nozzle is provided with an adsorption end and an assembly end which are opposite to each other, the adsorption end is provided with a pressing surface, the pressing surface is provided with a first suction port communicated with the gas channel, and the assembly end is provided with a second suction port communicated with the gas channel. The end face of the assembling end is provided with a second air suction port communicated with the air channel, the size of the pressing face is consistent with the size of a chip to be adsorbed, and the pressing face is a flat face. The suction nozzle integrally formed by the hard alloy material is high in hardness, the flattening diameter of a chip welding tin ball can be controlled and adjusted according to the design requirement, the design re |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN217114352UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN217114352UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN217114352UU3</originalsourceid><addsrcrecordid>eNrjZPAKLk0uyczPU8jLr6rKSVUoLikCCpQWpSqk5RcpFKfmZibn56UAhYC8tJzMAoXkDCCRm5hXmpYIUpeZl65QUJSfnFpczMPAmpaYU5zKC6W5GZTcXEOcPXRTC_LjU4sLEpNT81JL4p39jAzNDQ1NjE2NQkONiVIEACIQNvk</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Suction nozzle structure for semiconductor flip chip manufacturing process</title><source>esp@cenet</source><creator>LI WENXUE ; WANG JIAN ; WEI DONG ; ZHU LIHAI ; ZHANG LYU</creator><creatorcontrib>LI WENXUE ; WANG JIAN ; WEI DONG ; ZHU LIHAI ; ZHANG LYU</creatorcontrib><description>The utility model relates to a suction nozzle structure for a semiconductor flip chip process, which comprises a suction nozzle integrally formed by a hard alloy material, a gas channel is formed in the suction nozzle, the suction nozzle is provided with an adsorption end and an assembly end which are opposite to each other, the adsorption end is provided with a pressing surface, the pressing surface is provided with a first suction port communicated with the gas channel, and the assembly end is provided with a second suction port communicated with the gas channel. The end face of the assembling end is provided with a second air suction port communicated with the air channel, the size of the pressing face is consistent with the size of a chip to be adsorbed, and the pressing face is a flat face. The suction nozzle integrally formed by the hard alloy material is high in hardness, the flattening diameter of a chip welding tin ball can be controlled and adjusted according to the design requirement, the design re</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220802&DB=EPODOC&CC=CN&NR=217114352U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220802&DB=EPODOC&CC=CN&NR=217114352U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LI WENXUE</creatorcontrib><creatorcontrib>WANG JIAN</creatorcontrib><creatorcontrib>WEI DONG</creatorcontrib><creatorcontrib>ZHU LIHAI</creatorcontrib><creatorcontrib>ZHANG LYU</creatorcontrib><title>Suction nozzle structure for semiconductor flip chip manufacturing process</title><description>The utility model relates to a suction nozzle structure for a semiconductor flip chip process, which comprises a suction nozzle integrally formed by a hard alloy material, a gas channel is formed in the suction nozzle, the suction nozzle is provided with an adsorption end and an assembly end which are opposite to each other, the adsorption end is provided with a pressing surface, the pressing surface is provided with a first suction port communicated with the gas channel, and the assembly end is provided with a second suction port communicated with the gas channel. The end face of the assembling end is provided with a second air suction port communicated with the air channel, the size of the pressing face is consistent with the size of a chip to be adsorbed, and the pressing face is a flat face. The suction nozzle integrally formed by the hard alloy material is high in hardness, the flattening diameter of a chip welding tin ball can be controlled and adjusted according to the design requirement, the design re</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPAKLk0uyczPU8jLr6rKSVUoLikCCpQWpSqk5RcpFKfmZibn56UAhYC8tJzMAoXkDCCRm5hXmpYIUpeZl65QUJSfnFpczMPAmpaYU5zKC6W5GZTcXEOcPXRTC_LjU4sLEpNT81JL4p39jAzNDQ1NjE2NQkONiVIEACIQNvk</recordid><startdate>20220802</startdate><enddate>20220802</enddate><creator>LI WENXUE</creator><creator>WANG JIAN</creator><creator>WEI DONG</creator><creator>ZHU LIHAI</creator><creator>ZHANG LYU</creator><scope>EVB</scope></search><sort><creationdate>20220802</creationdate><title>Suction nozzle structure for semiconductor flip chip manufacturing process</title><author>LI WENXUE ; WANG JIAN ; WEI DONG ; ZHU LIHAI ; ZHANG LYU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN217114352UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>LI WENXUE</creatorcontrib><creatorcontrib>WANG JIAN</creatorcontrib><creatorcontrib>WEI DONG</creatorcontrib><creatorcontrib>ZHU LIHAI</creatorcontrib><creatorcontrib>ZHANG LYU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LI WENXUE</au><au>WANG JIAN</au><au>WEI DONG</au><au>ZHU LIHAI</au><au>ZHANG LYU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Suction nozzle structure for semiconductor flip chip manufacturing process</title><date>2022-08-02</date><risdate>2022</risdate><abstract>The utility model relates to a suction nozzle structure for a semiconductor flip chip process, which comprises a suction nozzle integrally formed by a hard alloy material, a gas channel is formed in the suction nozzle, the suction nozzle is provided with an adsorption end and an assembly end which are opposite to each other, the adsorption end is provided with a pressing surface, the pressing surface is provided with a first suction port communicated with the gas channel, and the assembly end is provided with a second suction port communicated with the gas channel. The end face of the assembling end is provided with a second air suction port communicated with the air channel, the size of the pressing face is consistent with the size of a chip to be adsorbed, and the pressing face is a flat face. The suction nozzle integrally formed by the hard alloy material is high in hardness, the flattening diameter of a chip welding tin ball can be controlled and adjusted according to the design requirement, the design re</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Suction nozzle structure for semiconductor flip chip manufacturing process |
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