Wafer clamp device
The utility model provides a wafer clamp device which comprises a bottom plate and two or more wafer supporting pieces, and wafer clamping grooves are formed in wafer fixing parts of the wafer supporting pieces in the direction parallel or approximately parallel to the upper surface of the bottom pl...
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| creator | LIU QING ZHANG MUQING WANG YAOHAO CHEN XIUFANG |
| description | The utility model provides a wafer clamp device which comprises a bottom plate and two or more wafer supporting pieces, and wafer clamping grooves are formed in wafer fixing parts of the wafer supporting pieces in the direction parallel or approximately parallel to the upper surface of the bottom plate. When in use, one or more wafer supporting pieces are detached from the bottom plate so as to leave a channel for mounting a wafer, the wafer is mounted in the wafer clamping groove of the wafer supporting piece mounted on the bottom plate, and after the wafer is loaded, the wafer fixing parts of the remaining wafer supporting pieces are mounted in the mounting parts of the wafer supporting pieces, so that the wafer is fixed. A plurality of wafer clamping grooves can be formed, so that the requirement of loading a plurality of wafers can be met; besides, the wafer supporting pieces on the periphery of the wafer are fixed, and the included angle between the wafer clamping groove and the upper surface of the bott |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN216818292UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN216818292UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN216818292UU3</originalsourceid><addsrcrecordid>eNrjZBAKT0xLLVJIzknMLVBISS3LTE7lYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxzn5GhmYWhhZGlkahocZEKQIAIjggjQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Wafer clamp device</title><source>esp@cenet</source><creator>LIU QING ; ZHANG MUQING ; WANG YAOHAO ; CHEN XIUFANG</creator><creatorcontrib>LIU QING ; ZHANG MUQING ; WANG YAOHAO ; CHEN XIUFANG</creatorcontrib><description>The utility model provides a wafer clamp device which comprises a bottom plate and two or more wafer supporting pieces, and wafer clamping grooves are formed in wafer fixing parts of the wafer supporting pieces in the direction parallel or approximately parallel to the upper surface of the bottom plate. When in use, one or more wafer supporting pieces are detached from the bottom plate so as to leave a channel for mounting a wafer, the wafer is mounted in the wafer clamping groove of the wafer supporting piece mounted on the bottom plate, and after the wafer is loaded, the wafer fixing parts of the remaining wafer supporting pieces are mounted in the mounting parts of the wafer supporting pieces, so that the wafer is fixed. A plurality of wafer clamping grooves can be formed, so that the requirement of loading a plurality of wafers can be met; besides, the wafer supporting pieces on the periphery of the wafer are fixed, and the included angle between the wafer clamping groove and the upper surface of the bott</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220624&DB=EPODOC&CC=CN&NR=216818292U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220624&DB=EPODOC&CC=CN&NR=216818292U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIU QING</creatorcontrib><creatorcontrib>ZHANG MUQING</creatorcontrib><creatorcontrib>WANG YAOHAO</creatorcontrib><creatorcontrib>CHEN XIUFANG</creatorcontrib><title>Wafer clamp device</title><description>The utility model provides a wafer clamp device which comprises a bottom plate and two or more wafer supporting pieces, and wafer clamping grooves are formed in wafer fixing parts of the wafer supporting pieces in the direction parallel or approximately parallel to the upper surface of the bottom plate. When in use, one or more wafer supporting pieces are detached from the bottom plate so as to leave a channel for mounting a wafer, the wafer is mounted in the wafer clamping groove of the wafer supporting piece mounted on the bottom plate, and after the wafer is loaded, the wafer fixing parts of the remaining wafer supporting pieces are mounted in the mounting parts of the wafer supporting pieces, so that the wafer is fixed. A plurality of wafer clamping grooves can be formed, so that the requirement of loading a plurality of wafers can be met; besides, the wafer supporting pieces on the periphery of the wafer are fixed, and the included angle between the wafer clamping groove and the upper surface of the bott</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAKT0xLLVJIzknMLVBISS3LTE7lYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxzn5GhmYWhhZGlkahocZEKQIAIjggjQ</recordid><startdate>20220624</startdate><enddate>20220624</enddate><creator>LIU QING</creator><creator>ZHANG MUQING</creator><creator>WANG YAOHAO</creator><creator>CHEN XIUFANG</creator><scope>EVB</scope></search><sort><creationdate>20220624</creationdate><title>Wafer clamp device</title><author>LIU QING ; ZHANG MUQING ; WANG YAOHAO ; CHEN XIUFANG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN216818292UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>LIU QING</creatorcontrib><creatorcontrib>ZHANG MUQING</creatorcontrib><creatorcontrib>WANG YAOHAO</creatorcontrib><creatorcontrib>CHEN XIUFANG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LIU QING</au><au>ZHANG MUQING</au><au>WANG YAOHAO</au><au>CHEN XIUFANG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Wafer clamp device</title><date>2022-06-24</date><risdate>2022</risdate><abstract>The utility model provides a wafer clamp device which comprises a bottom plate and two or more wafer supporting pieces, and wafer clamping grooves are formed in wafer fixing parts of the wafer supporting pieces in the direction parallel or approximately parallel to the upper surface of the bottom plate. When in use, one or more wafer supporting pieces are detached from the bottom plate so as to leave a channel for mounting a wafer, the wafer is mounted in the wafer clamping groove of the wafer supporting piece mounted on the bottom plate, and after the wafer is loaded, the wafer fixing parts of the remaining wafer supporting pieces are mounted in the mounting parts of the wafer supporting pieces, so that the wafer is fixed. A plurality of wafer clamping grooves can be formed, so that the requirement of loading a plurality of wafers can be met; besides, the wafer supporting pieces on the periphery of the wafer are fixed, and the included angle between the wafer clamping groove and the upper surface of the bott</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Wafer clamp device |
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