Grinding and polishing device
According to the technical scheme, the grinding and polishing device comprises a supporting frame, a grinding and polishing mechanism is arranged in the supporting frame, and the grinding and polishing mechanism extends to the outer side of the supporting frame; the grinding and polishing device has...
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| creator | FANG YUANYONG |
| description | According to the technical scheme, the grinding and polishing device comprises a supporting frame, a grinding and polishing mechanism is arranged in the supporting frame, and the grinding and polishing mechanism extends to the outer side of the supporting frame; the grinding and polishing device has the beneficial effects that a user can adjust the position of the grinding piece according to the length, width and height of a workpiece, when the workpiece needs to move left and right and up and down, the user can hold the U-shaped frame to move left and right and up and down to drive the grinding piece to move, and when the grinding piece moves to a designated position, the user can conveniently adjust the position of the grinding piece. The base drives the two first springs, the grinding piece and the two square blocks to rotate, so that workpieces of different sizes and different positions of the workpieces needing to be ground can be adapted by adjusting the positions of the grinding blocks, a worker can co |
| format | Patent |
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The base drives the two first springs, the grinding piece and the two square blocks to rotate, so that workpieces of different sizes and different positions of the workpieces needing to be ground can be adapted by adjusting the positions of the grinding blocks, a worker can co</description><language>chi ; eng</language><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; MEASURING ; PERFORMING OPERATIONS ; PHYSICS ; POLISHING ; TESTING ; TRANSPORTING</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220614&DB=EPODOC&CC=CN&NR=216731074U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220614&DB=EPODOC&CC=CN&NR=216731074U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FANG YUANYONG</creatorcontrib><title>Grinding and polishing device</title><description>According to the technical scheme, the grinding and polishing device comprises a supporting frame, a grinding and polishing mechanism is arranged in the supporting frame, and the grinding and polishing mechanism extends to the outer side of the supporting frame; the grinding and polishing device has the beneficial effects that a user can adjust the position of the grinding piece according to the length, width and height of a workpiece, when the workpiece needs to move left and right and up and down, the user can hold the U-shaped frame to move left and right and up and down to drive the grinding piece to move, and when the grinding piece moves to a designated position, the user can conveniently adjust the position of the grinding piece. The base drives the two first springs, the grinding piece and the two square blocks to rotate, so that workpieces of different sizes and different positions of the workpieces needing to be ground can be adapted by adjusting the positions of the grinding blocks, a worker can co</description><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>MEASURING</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICS</subject><subject>POLISHING</subject><subject>TESTING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJB1L8rMS8nMS1dIzEtRKMjPySzOAPFSUssyk1N5GFjTEnOKU3mhNDeDkptriLOHbmpBfnxqcUFicmpeakm8s5-RoZm5saGBuUloqDFRigAQhyTY</recordid><startdate>20220614</startdate><enddate>20220614</enddate><creator>FANG YUANYONG</creator><scope>EVB</scope></search><sort><creationdate>20220614</creationdate><title>Grinding and polishing device</title><author>FANG YUANYONG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN216731074UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>MEASURING</topic><topic>PERFORMING OPERATIONS</topic><topic>PHYSICS</topic><topic>POLISHING</topic><topic>TESTING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>FANG YUANYONG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>FANG YUANYONG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Grinding and polishing device</title><date>2022-06-14</date><risdate>2022</risdate><abstract>According to the technical scheme, the grinding and polishing device comprises a supporting frame, a grinding and polishing mechanism is arranged in the supporting frame, and the grinding and polishing mechanism extends to the outer side of the supporting frame; the grinding and polishing device has the beneficial effects that a user can adjust the position of the grinding piece according to the length, width and height of a workpiece, when the workpiece needs to move left and right and up and down, the user can hold the U-shaped frame to move left and right and up and down to drive the grinding piece to move, and when the grinding piece moves to a designated position, the user can conveniently adjust the position of the grinding piece. 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| language | chi ; eng |
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| subjects | DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MEASURING PERFORMING OPERATIONS PHYSICS POLISHING TESTING TRANSPORTING |
| title | Grinding and polishing device |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-05T17%3A39%3A42IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=FANG%20YUANYONG&rft.date=2022-06-14&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN216731074UU%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |