Liquid cooling and forced air cooling power amplifier heat dissipation system
The utility model discloses a liquid cooling and forced air cooling power amplifier heat dissipation system, which comprises a case, a liquid injection port and a fan used for taking away heat in the case are arranged on the outer side of the case, a heat exchanger, a controller, a temperature senso...
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| creator | JIANG MINTAO WANG HAINING LYU JIASEN |
| description | The utility model discloses a liquid cooling and forced air cooling power amplifier heat dissipation system, which comprises a case, a liquid injection port and a fan used for taking away heat in the case are arranged on the outer side of the case, a heat exchanger, a controller, a temperature sensor, a liquid pump and a liquid cooling plate are arranged in the case, and a power amplifier module is mounted on the liquid cooling plate. A water outlet of the liquid cooling plate is connected with a water inlet of the liquid pump, a water outlet of the liquid pump is connected with a water inlet of the heat exchanger, a water outlet of the heat exchanger is connected with a water inlet of the liquid cooling plate, a detection end of the temperature sensor extends into the heat exchanger, and the controller is connected with the fan, the liquid pump and the temperature sensor. On the basis of combination of liquid cooling and air cooling, the power amplifier case is compact in structure and good in heat uniformit |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN216673682UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN216673682UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN216673682UU3</originalsourceid><addsrcrecordid>eNqNijEKAjEQANNYiPqHxd7CO4j2h2KhVl59LMlGF3LZmI2Iv9dCrK1mGGZqTke-P9iDE4mcroDJQ5DiyANy-eUsTyqAY44c-GM3wgqeVTljZUmgL600zs0kYFRafDkzy_3u0h1WlGUgzegoUR26c7O2dtPabdP37V_TG1qwN04</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Liquid cooling and forced air cooling power amplifier heat dissipation system</title><source>esp@cenet</source><creator>JIANG MINTAO ; WANG HAINING ; LYU JIASEN</creator><creatorcontrib>JIANG MINTAO ; WANG HAINING ; LYU JIASEN</creatorcontrib><description>The utility model discloses a liquid cooling and forced air cooling power amplifier heat dissipation system, which comprises a case, a liquid injection port and a fan used for taking away heat in the case are arranged on the outer side of the case, a heat exchanger, a controller, a temperature sensor, a liquid pump and a liquid cooling plate are arranged in the case, and a power amplifier module is mounted on the liquid cooling plate. A water outlet of the liquid cooling plate is connected with a water inlet of the liquid pump, a water outlet of the liquid pump is connected with a water inlet of the heat exchanger, a water outlet of the heat exchanger is connected with a water inlet of the liquid cooling plate, a detection end of the temperature sensor extends into the heat exchanger, and the controller is connected with the fan, the liquid pump and the temperature sensor. On the basis of combination of liquid cooling and air cooling, the power amplifier case is compact in structure and good in heat uniformit</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220603&DB=EPODOC&CC=CN&NR=216673682U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220603&DB=EPODOC&CC=CN&NR=216673682U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>JIANG MINTAO</creatorcontrib><creatorcontrib>WANG HAINING</creatorcontrib><creatorcontrib>LYU JIASEN</creatorcontrib><title>Liquid cooling and forced air cooling power amplifier heat dissipation system</title><description>The utility model discloses a liquid cooling and forced air cooling power amplifier heat dissipation system, which comprises a case, a liquid injection port and a fan used for taking away heat in the case are arranged on the outer side of the case, a heat exchanger, a controller, a temperature sensor, a liquid pump and a liquid cooling plate are arranged in the case, and a power amplifier module is mounted on the liquid cooling plate. A water outlet of the liquid cooling plate is connected with a water inlet of the liquid pump, a water outlet of the liquid pump is connected with a water inlet of the heat exchanger, a water outlet of the heat exchanger is connected with a water inlet of the liquid cooling plate, a detection end of the temperature sensor extends into the heat exchanger, and the controller is connected with the fan, the liquid pump and the temperature sensor. On the basis of combination of liquid cooling and air cooling, the power amplifier case is compact in structure and good in heat uniformit</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNijEKAjEQANNYiPqHxd7CO4j2h2KhVl59LMlGF3LZmI2Iv9dCrK1mGGZqTke-P9iDE4mcroDJQ5DiyANy-eUsTyqAY44c-GM3wgqeVTljZUmgL600zs0kYFRafDkzy_3u0h1WlGUgzegoUR26c7O2dtPabdP37V_TG1qwN04</recordid><startdate>20220603</startdate><enddate>20220603</enddate><creator>JIANG MINTAO</creator><creator>WANG HAINING</creator><creator>LYU JIASEN</creator><scope>EVB</scope></search><sort><creationdate>20220603</creationdate><title>Liquid cooling and forced air cooling power amplifier heat dissipation system</title><author>JIANG MINTAO ; WANG HAINING ; LYU JIASEN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN216673682UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>JIANG MINTAO</creatorcontrib><creatorcontrib>WANG HAINING</creatorcontrib><creatorcontrib>LYU JIASEN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>JIANG MINTAO</au><au>WANG HAINING</au><au>LYU JIASEN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Liquid cooling and forced air cooling power amplifier heat dissipation system</title><date>2022-06-03</date><risdate>2022</risdate><abstract>The utility model discloses a liquid cooling and forced air cooling power amplifier heat dissipation system, which comprises a case, a liquid injection port and a fan used for taking away heat in the case are arranged on the outer side of the case, a heat exchanger, a controller, a temperature sensor, a liquid pump and a liquid cooling plate are arranged in the case, and a power amplifier module is mounted on the liquid cooling plate. A water outlet of the liquid cooling plate is connected with a water inlet of the liquid pump, a water outlet of the liquid pump is connected with a water inlet of the heat exchanger, a water outlet of the heat exchanger is connected with a water inlet of the liquid cooling plate, a detection end of the temperature sensor extends into the heat exchanger, and the controller is connected with the fan, the liquid pump and the temperature sensor. On the basis of combination of liquid cooling and air cooling, the power amplifier case is compact in structure and good in heat uniformit</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Liquid cooling and forced air cooling power amplifier heat dissipation system |
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