Solid-state relay

Solid-state relay

The utility model relates to a solid-state relay, which comprises a shell, a circuit board, a metal oxide semiconductor (MOS) tube, a heat dissipation block and a heat conduction column are arranged in the shell, the MOS tube is arranged on the front face of the circuit board, the heat dissipation b...

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Hauptverfasser: CHE JIAYU, LIN XIAOJUN, XIONG WEIQING, LI WEI, CHEN RENZONG, CHEN ZELONG, KO HANBYUL, HONG JIAQI, LIU CHUNQING
Format: Patent
Sprache:chi ; eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator CHE JIAYU
LIN XIAOJUN
XIONG WEIQING
LI WEI
CHEN RENZONG
CHEN ZELONG
KO HANBYUL
HONG JIAQI
LIU CHUNQING
description The utility model relates to a solid-state relay, which comprises a shell, a circuit board, a metal oxide semiconductor (MOS) tube, a heat dissipation block and a heat conduction column are arranged in the shell, the MOS tube is arranged on the front face of the circuit board, the heat dissipation block and the heat conduction column are arranged on the back face of the circuit board, and the end portion of the heat conduction column is inserted in the heat dissipation block. A positioning hole is formed in the circuit board, a heat-conducting gasket is welded in the positioning hole through reflow soldering, the heat-conducting gasket is in contact with the MOS tube, the MOS tube is welded on the circuit board through reflow soldering, and the heat-conducting column is welded on the heat-conducting gasket through reflow soldering. By adopting the technical scheme, the utility model provides the solid-state relay, the heat-conducting gasket is welded on the back surface of the circuit board by utilizing reflo
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title Solid-state relay
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