High-density fan-out packaging structure

High-density fan-out packaging structure

The utility model discloses a high-density fan-out packaging structure, which comprises a substrate, a heat dissipation glue layer, salient points, a metal circuit layer, a filling layer, a plastic packaging layer and a metal film, the metal circuit layer is connected with a chip, the filling layer...

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Hauptverfasser: GUO HONGHONG, ZHOU JIANGNAN
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator GUO HONGHONG
ZHOU JIANGNAN
description The utility model discloses a high-density fan-out packaging structure, which comprises a substrate, a heat dissipation glue layer, salient points, a metal circuit layer, a filling layer, a plastic packaging layer and a metal film, the metal circuit layer is connected with a chip, the filling layer is arranged at the bottom of the chip and is connected with the metal circuit layer, the bottom of the metal circuit layer is provided with a plurality of salient points, the salient points are connected with the metal circuit layer and the substrate, and the plastic packaging layer is arranged on the substrate. The plastic packaging layer wraps the chip and the filling layer, the metal film is arranged on the top face of the chip, and the heat dissipation glue layer wraps the metal film above the substrate and is connected with the heat dissipation plate. The high-density fan-out packaging structure provided by the utility model is reliable in structure, reduces the packaging thickness, reduces the thermal resista
format Patent
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The plastic packaging layer wraps the chip and the filling layer, the metal film is arranged on the top face of the chip, and the heat dissipation glue layer wraps the metal film above the substrate and is connected with the heat dissipation plate. 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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title High-density fan-out packaging structure
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