Bonding tool of semiconductor module

Bonding tool of semiconductor module

The utility model discloses a semiconductor module bonding tool, comprising a workbench and a mounting rack, the mounting rack is internally provided with a mounting plate, the mounting plate is internally provided with a hold-down assembly, the hold-down assembly comprises an adjusting member, a pr...

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1. Verfasser: WENG XIAOSHENG
Format: Patent
Sprache:chi ; eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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description The utility model discloses a semiconductor module bonding tool, comprising a workbench and a mounting rack, the mounting rack is internally provided with a mounting plate, the mounting plate is internally provided with a hold-down assembly, the hold-down assembly comprises an adjusting member, a pressing plate, a spring, a clamping block and a mounting cylinder, the workbench is internally provided with a positioning hole, and the positioning hole is provided with a positioning hole. The mounting frame is fixedly mounted at the top of the workbench, and an adjusting assembly is arranged in the mounting plate; in the technical scheme provided by the utility model, the module is fixed by arranging the adjusting assembly and the pressing assembly, the module on the workbench is clamped by moving the mounting plate through the adjusting assembly, and the edge of the module is pressed through the pressing assembly, so that the module is prevented from falling off and being damaged in the inclination process of th
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The mounting frame is fixedly mounted at the top of the workbench, and an adjusting assembly is arranged in the mounting plate; in the technical scheme provided by the utility model, the module is fixed by arranging the adjusting assembly and the pressing assembly, the module on the workbench is clamped by moving the mounting plate through the adjusting assembly, and the edge of the module is pressed through the pressing assembly, so that the module is prevented from falling off and being damaged in the inclination process of th</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20220201&amp;DB=EPODOC&amp;CC=CN&amp;NR=215731616U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20220201&amp;DB=EPODOC&amp;CC=CN&amp;NR=215731616U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WENG XIAOSHENG</creatorcontrib><title>Bonding tool of semiconductor module</title><description>The utility model discloses a semiconductor module bonding tool, comprising a workbench and a mounting rack, the mounting rack is internally provided with a mounting plate, the mounting plate is internally provided with a hold-down assembly, the hold-down assembly comprises an adjusting member, a pressing plate, a spring, a clamping block and a mounting cylinder, the workbench is internally provided with a positioning hole, and the positioning hole is provided with a positioning hole. 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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Bonding tool of semiconductor module
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