Solid-liquid separation system for semiconductor wafer manufacturing and processing equipment
The utility model relates to a solid-liquid separation system for manufacturing a semiconductor wafer and processing equipment. The solid-liquid separation system comprises: a sedimentation tank; the liquid inlet pump is connected with the sedimentation tank; the liquid inlet box is connected to the...
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creator | HONG QINGFU |
description | The utility model relates to a solid-liquid separation system for manufacturing a semiconductor wafer and processing equipment. The solid-liquid separation system comprises: a sedimentation tank; the liquid inlet pump is connected with the sedimentation tank; the liquid inlet box is connected to the sedimentation tank through the liquid inlet pump; a water return pool; an inlet of the water return pump is connected to the water return pool, an outlet of the water return pump is connected to the sedimentation pool, and the water return pump further comprises an external connector on the outlet side; the solid-liquid separation device comprises a liquid inlet and a water outlet, the liquid inlet is connected to the liquid inlet box, and the water outlet is connected to the water return pool; wherein the liquid inlet box and the water return pool are respectively provided with a liquid level sensor. The processing equipment comprises the solid-liquid separation system for the semiconductor wafer manufacturing pr |
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The solid-liquid separation system comprises: a sedimentation tank; the liquid inlet pump is connected with the sedimentation tank; the liquid inlet box is connected to the sedimentation tank through the liquid inlet pump; a water return pool; an inlet of the water return pump is connected to the water return pool, an outlet of the water return pump is connected to the sedimentation pool, and the water return pump further comprises an external connector on the outlet side; the solid-liquid separation device comprises a liquid inlet and a water outlet, the liquid inlet is connected to the liquid inlet box, and the water outlet is connected to the water return pool; wherein the liquid inlet box and the water return pool are respectively provided with a liquid level sensor. 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The solid-liquid separation system comprises: a sedimentation tank; the liquid inlet pump is connected with the sedimentation tank; the liquid inlet box is connected to the sedimentation tank through the liquid inlet pump; a water return pool; an inlet of the water return pump is connected to the water return pool, an outlet of the water return pump is connected to the sedimentation pool, and the water return pump further comprises an external connector on the outlet side; the solid-liquid separation device comprises a liquid inlet and a water outlet, the liquid inlet is connected to the liquid inlet box, and the water outlet is connected to the water return pool; wherein the liquid inlet box and the water return pool are respectively provided with a liquid level sensor. The processing equipment comprises the solid-liquid separation system for the semiconductor wafer manufacturing pr</description><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL</subject><subject>POLISHING</subject><subject>SEPARATION</subject><subject>TRANSPORTING</subject><subject>WORKING CEMENT, CLAY, OR STONE</subject><subject>WORKING STONE OR STONE-LIKE MATERIALS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjLsKAjEQRdNYiPoPwX6LKL7qRbGy0S1lGZKJBJJJzCSIf28EP8DqcA6XOxX3a_TOdN49qzOSMUGG4iJJfnPBIG3MrQanI5mqS7MXWMwyAFULutTs6CGBjEw5amT-KrazFJDKXEwseMbFjzOxPB1v_bnDFEfkBBoJy9hfVmqzPaj9Tg3D-q_RByRePmo</recordid><startdate>20220201</startdate><enddate>20220201</enddate><creator>HONG QINGFU</creator><scope>EVB</scope></search><sort><creationdate>20220201</creationdate><title>Solid-liquid separation system for semiconductor wafer manufacturing and processing equipment</title><author>HONG QINGFU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN215691871UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL</topic><topic>POLISHING</topic><topic>SEPARATION</topic><topic>TRANSPORTING</topic><topic>WORKING CEMENT, CLAY, OR STONE</topic><topic>WORKING STONE OR STONE-LIKE MATERIALS</topic><toplevel>online_resources</toplevel><creatorcontrib>HONG QINGFU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HONG QINGFU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Solid-liquid separation system for semiconductor wafer manufacturing and processing equipment</title><date>2022-02-01</date><risdate>2022</risdate><abstract>The utility model relates to a solid-liquid separation system for manufacturing a semiconductor wafer and processing equipment. The solid-liquid separation system comprises: a sedimentation tank; the liquid inlet pump is connected with the sedimentation tank; the liquid inlet box is connected to the sedimentation tank through the liquid inlet pump; a water return pool; an inlet of the water return pump is connected to the water return pool, an outlet of the water return pump is connected to the sedimentation pool, and the water return pump further comprises an external connector on the outlet side; the solid-liquid separation device comprises a liquid inlet and a water outlet, the liquid inlet is connected to the liquid inlet box, and the water outlet is connected to the water return pool; wherein the liquid inlet box and the water return pool are respectively provided with a liquid level sensor. The processing equipment comprises the solid-liquid separation system for the semiconductor wafer manufacturing pr</abstract><oa>free_for_read</oa></addata></record> |
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language | chi ; eng |
recordid | cdi_epo_espacenet_CN215691871UU |
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subjects | DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL POLISHING SEPARATION TRANSPORTING WORKING CEMENT, CLAY, OR STONE WORKING STONE OR STONE-LIKE MATERIALS |
title | Solid-liquid separation system for semiconductor wafer manufacturing and processing equipment |
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