Semi-automatic braiding machine outer frame mechanism for semiconductor chip

The semi-automatic braiding machine outer frame mechanism for the semiconductor chip comprises a frame body, a workbench is arranged in the frame body, the workbench divides an inner cavity of the frame body into an upper cavity body and a lower cavity body in the vertical direction, a braiding assembly is contained in the lower cavity body, and the braiding assembly is used for braiding the chip; a discharging rotating shaft is arranged at the top of the frame body and used for unwinding a braid plate, and a through hole is formed in the top of the frame body and communicates with the upper cavity; wherein a discharge hole is formed in the side wall of the frame body; a braiding plate is put down at the top, so that a worker can perform assembling and embedding in the upper cavity, then the lower cavity is set as an automatic braiding assembly placing area, the frame space can be fully used, a stable structure is formed, and the operation safety is guaranteed; meanwhile, a worker can observe the operation co