White laser light source packaging structure

The utility model discloses a white laser light source packaging structure, which comprises a substrate, a laser chip and an optical lens, wherein the laser chip and the optical lens are attached to the substrate through eutectic soldering or high-temperature solder paste soldering; the laser chip i...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HUANG MIN, YIN KEXIONG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING DEVICES USING STIMULATED EMISSION ELECTRICITY HEATING INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED LIGHT SOURCES NOT OTHERWISE PROVIDED FOR LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATINGELEMENTS LIGHTING MECHANICAL ENGINEERING NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE WEAPONS
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