White laser light source packaging structure

The utility model discloses a white laser light source packaging structure, which comprises a substrate, a laser chip and an optical lens, wherein the laser chip and the optical lens are attached to the substrate through eutectic soldering or high-temperature solder paste soldering; the laser chip i...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: HUANG MIN, YIN KEXIONG
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:The utility model discloses a white laser light source packaging structure, which comprises a substrate, a laser chip and an optical lens, wherein the laser chip and the optical lens are attached to the substrate through eutectic soldering or high-temperature solder paste soldering; the laser chip is a blue laser chip of a vertical structure or a blue laser chip of an inverted structure, the substrate is provided with a first polarity and a second polarity, the first polarity is arranged at the upper part of the substrate, and the second polarity is arranged at the bottom of the substrate; the laser chip is connected with the first polarity of the substrate and the second polarity of the substrate through bonding wires, a light-emitting area of the laser chip is covered with fluorescent glue, and the optical lens is solidified and pasted in the substrate through the glue. According to the utility model, the problems of high cost and difficult process of a ceramic fluorescent sheet in the market can be solved,