Novel center plate structure for encapsulating mold

Novel center plate structure for encapsulating mold

The utility model relates to a novel center plate structure of an encapsulation mold, which structurally comprises a template and a cleaning mechanism mounted in the template, a forming groove is arranged at the center of the top surface of the template, radiating grooves are arranged on two sides o...

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1. Verfasser: HUANG HAIBIAO
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator HUANG HAIBIAO
description The utility model relates to a novel center plate structure of an encapsulation mold, which structurally comprises a template and a cleaning mechanism mounted in the template, a forming groove is arranged at the center of the top surface of the template, radiating grooves are arranged on two sides of the top surface of the template, the cleaning mechanism comprises a main air groove horizontally arranged in the template, one end of the main air groove is connected with an air pipe connector, and the other end of the main air groove is provided with a connecting air groove. A mounting groove is formed in the top of the diversion air groove, a folding air pipe is arranged in the mounting groove, the bottom end of the folding air pipe is connected with the diversion air groove, an air tap seat is rotationally connected into the mounting groove, an air tap hole is formed in the air tap seat, the top end of the folding air pipe is connected with one end of the air tap hole, and the other end of the air tap hole ex
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language chi ; eng
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Novel center plate structure for encapsulating mold
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