Bonding pad, battery piece and battery assembly

Bonding pad, battery piece and battery assembly

The invention relates to the technical field of photovoltaic modules, and discloses a bonding pad, a battery piece and a battery assembly, the bonding pad comprises a bonding pad body, the surface, used for being connected with a main grid, of the bonding pad body is arranged to be of a concave-conv...

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Hauptverfasser: HU CHENG, MENG QINGPENG, XU QINGFENG, YE CHUANJIAN, LIU PENGYU, LIAN MIAOBIN
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator HU CHENG
MENG QINGPENG
XU QINGFENG
YE CHUANJIAN
LIU PENGYU
LIAN MIAOBIN
description The invention relates to the technical field of photovoltaic modules, and discloses a bonding pad, a battery piece and a battery assembly, the bonding pad comprises a bonding pad body, the surface, used for being connected with a main grid, of the bonding pad body is arranged to be of a concave-convex structure to form a rough surface, and the roughness of the surface of the bonding pad influences the interface area of soldering tin and silver paste. The force required for stripping the soldering tin is related to the geometric area, so that the force of the soldering tin attached to the bonding pad silver paste is related to the actual interface contact area. As the surface area is increased and the difficulty of stripping soldering tin is increased, the surface area is increased by providing a rough surface, so that the adhesive force is increased, the soldering tin is in full contact with bonding pad silver paste, the pseudo soldering rate is reduced, and the production yield of a battery piece and a batte
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Bonding pad, battery piece and battery assembly
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