Stepping type conveying device of lead frame
The utility model relates to a stepping type conveying device of a lead frame, which comprises a supporting platform and a stepping type traction mechanism, the supporting platform is used for placing the lead frame and supporting the lead frame from the bottom, the stepping type traction mechanism...
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creator | YI BINGCHUAN SI YIPING HU TEGANG MO ZHISHENG RAO XILIN HUANG DONG |
description | The utility model relates to a stepping type conveying device of a lead frame, which comprises a supporting platform and a stepping type traction mechanism, the supporting platform is used for placing the lead frame and supporting the lead frame from the bottom, the stepping type traction mechanism is used for driving the lead frame to move forwards on the supporting platform in a stepping mode, and the supporting platform is further provided with a supporting boss. The length direction of the supporting boss is the same as the traction direction, the supporting boss is used for supporting the lower surface of the pin, and chamfers are arranged on the two side faces of the supporting boss. The base islands and the pins can be stably supported, in the bonding process, the state is stable, quality abnormity is not prone to occurring, the yield is improved, the bonding head waiting time is shortened, and the production efficiency is improved; the two side faces of the supporting boss are chamfered, so that a cer |
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The length direction of the supporting boss is the same as the traction direction, the supporting boss is used for supporting the lower surface of the pin, and chamfers are arranged on the two side faces of the supporting boss. The base islands and the pins can be stably supported, in the bonding process, the state is stable, quality abnormity is not prone to occurring, the yield is improved, the bonding head waiting time is shortened, and the production efficiency is improved; the two side faces of the supporting boss are chamfered, so that a cer</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAJLkktKMjMS1coqSxIVUjOzytLrQRxU1LLMpNTFfLTFHJSE1MU0ooSc1N5GFjTEnOKU3mhNDeDkptriLOHbmpBfnxqcUFicmpeakm8s5-RoamRmZmRkXloqDFRigDh8Spt</recordid><startdate>20211221</startdate><enddate>20211221</enddate><creator>YI BINGCHUAN</creator><creator>SI YIPING</creator><creator>HU TEGANG</creator><creator>MO ZHISHENG</creator><creator>RAO XILIN</creator><creator>HUANG DONG</creator><scope>EVB</scope></search><sort><creationdate>20211221</creationdate><title>Stepping type conveying device of lead frame</title><author>YI BINGCHUAN ; SI YIPING ; HU TEGANG ; MO ZHISHENG ; RAO XILIN ; HUANG DONG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN215266227UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>YI BINGCHUAN</creatorcontrib><creatorcontrib>SI YIPING</creatorcontrib><creatorcontrib>HU TEGANG</creatorcontrib><creatorcontrib>MO ZHISHENG</creatorcontrib><creatorcontrib>RAO XILIN</creatorcontrib><creatorcontrib>HUANG DONG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YI BINGCHUAN</au><au>SI YIPING</au><au>HU TEGANG</au><au>MO ZHISHENG</au><au>RAO XILIN</au><au>HUANG DONG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Stepping type conveying device of lead frame</title><date>2021-12-21</date><risdate>2021</risdate><abstract>The utility model relates to a stepping type conveying device of a lead frame, which comprises a supporting platform and a stepping type traction mechanism, the supporting platform is used for placing the lead frame and supporting the lead frame from the bottom, the stepping type traction mechanism is used for driving the lead frame to move forwards on the supporting platform in a stepping mode, and the supporting platform is further provided with a supporting boss. The length direction of the supporting boss is the same as the traction direction, the supporting boss is used for supporting the lower surface of the pin, and chamfers are arranged on the two side faces of the supporting boss. The base islands and the pins can be stably supported, in the bonding process, the state is stable, quality abnormity is not prone to occurring, the yield is improved, the bonding head waiting time is shortened, and the production efficiency is improved; the two side faces of the supporting boss are chamfered, so that a cer</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | Stepping type conveying device of lead frame |
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