Packaging device for integrated circuit

Packaging device for integrated circuit

The utility model discloses a packaging device for an integrated circuit, and relates to the technical field of integrated circuits. Comprising a rectangular frame, a partition plate is fixedly installed between the left inner wall and the right inner wall of the rectangular frame and divides the in...

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1. Verfasser: TANG ZHENGHUI
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator TANG ZHENGHUI
description The utility model discloses a packaging device for an integrated circuit, and relates to the technical field of integrated circuits. Comprising a rectangular frame, a partition plate is fixedly installed between the left inner wall and the right inner wall of the rectangular frame and divides the interior of the rectangular frame into a packaging chamber and a heat dissipation chamber from top to bottom in sequence, fixing blocks are fixedly installed on the portions, close to the left and the right, of the rear side face of the rectangular frame, and a clamping plate is fixedly installed between the left fixing block and the right fixing block through an adjusting mechanism; the adjusting mechanism comprises a bearing seat, a lead screw and a ball nut, the clamping plate is inserted into the packaging chamber, a pressing mechanism is arranged on the clamping plate, the pressing mechanism comprises a bolt rod, a rotating disc and a pressing plate, and a heat dissipation mechanism is arranged in the heat dissi
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language chi ; eng
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Packaging device for integrated circuit
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