Computer heat dissipation structure for software design

The utility model discloses a computer heat dissipation structure for software design, and relates to the field of computers. The computer heat dissipation structure for software design comprises a computer main body, and heat dissipation holes are formed in the bottom of the computer main body; the...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: LI XIANNA, YUE TENGFEI, WANG LIXIANG, JING FANG, LIU JIANWEI
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!