Computer heat dissipation structure for software design
The utility model discloses a computer heat dissipation structure for software design, and relates to the field of computers. The computer heat dissipation structure for software design comprises a computer main body, and heat dissipation holes are formed in the bottom of the computer main body; the...
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creator | LI XIANNA YUE TENGFEI WANG LIXIANG JING FANG LIU JIANWEI |
description | The utility model discloses a computer heat dissipation structure for software design, and relates to the field of computers. The computer heat dissipation structure for software design comprises a computer main body, and heat dissipation holes are formed in the bottom of the computer main body; the telescopic mechanism comprises a connecting plate, and the connecting plate is rotationally connected to the bottom of the computer body through a rotating shaft. According to the computer heat dissipation structure for software design, the heat dissipation holes are formed in the bottom of the computer body, the heat dissipation area is increased, and the connecting plate and the computer body are in an inclined state by setting the connecting relation among the connecting block, the rotating plate, the supporting plate, the sliding block, the fixed block, the moving groove, the fixed plate, the limiting column and the limiting hook; the bottom of the computer is prevented from being attached to the desktop, the |
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fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN215117439UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN215117439UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN215117439UU3</originalsourceid><addsrcrecordid>eNrjZDB3zs8tKC1JLVLISE0sUUjJLC7OLEgsyczPUyguKSpNLiktSlVIyy9SKM5PKylPBHJSUosz0_N4GFjTEnOKU3mhNDeDkptriLOHbmpBfnxqcUFicmpeakm8s5-RoamhobmJsWVoqDFRigCEIC9p</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Computer heat dissipation structure for software design</title><source>esp@cenet</source><creator>LI XIANNA ; YUE TENGFEI ; WANG LIXIANG ; JING FANG ; LIU JIANWEI</creator><creatorcontrib>LI XIANNA ; YUE TENGFEI ; WANG LIXIANG ; JING FANG ; LIU JIANWEI</creatorcontrib><description>The utility model discloses a computer heat dissipation structure for software design, and relates to the field of computers. The computer heat dissipation structure for software design comprises a computer main body, and heat dissipation holes are formed in the bottom of the computer main body; the telescopic mechanism comprises a connecting plate, and the connecting plate is rotationally connected to the bottom of the computer body through a rotating shaft. According to the computer heat dissipation structure for software design, the heat dissipation holes are formed in the bottom of the computer body, the heat dissipation area is increased, and the connecting plate and the computer body are in an inclined state by setting the connecting relation among the connecting block, the rotating plate, the supporting plate, the sliding block, the fixed block, the moving groove, the fixed plate, the limiting column and the limiting hook; the bottom of the computer is prevented from being attached to the desktop, the</description><language>chi ; eng</language><subject>CALCULATING ; COMPUTING ; COUNTING ; ELECTRIC DIGITAL DATA PROCESSING ; PHYSICS</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211210&DB=EPODOC&CC=CN&NR=215117439U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211210&DB=EPODOC&CC=CN&NR=215117439U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LI XIANNA</creatorcontrib><creatorcontrib>YUE TENGFEI</creatorcontrib><creatorcontrib>WANG LIXIANG</creatorcontrib><creatorcontrib>JING FANG</creatorcontrib><creatorcontrib>LIU JIANWEI</creatorcontrib><title>Computer heat dissipation structure for software design</title><description>The utility model discloses a computer heat dissipation structure for software design, and relates to the field of computers. The computer heat dissipation structure for software design comprises a computer main body, and heat dissipation holes are formed in the bottom of the computer main body; the telescopic mechanism comprises a connecting plate, and the connecting plate is rotationally connected to the bottom of the computer body through a rotating shaft. According to the computer heat dissipation structure for software design, the heat dissipation holes are formed in the bottom of the computer body, the heat dissipation area is increased, and the connecting plate and the computer body are in an inclined state by setting the connecting relation among the connecting block, the rotating plate, the supporting plate, the sliding block, the fixed block, the moving groove, the fixed plate, the limiting column and the limiting hook; the bottom of the computer is prevented from being attached to the desktop, the</description><subject>CALCULATING</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>PHYSICS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDB3zs8tKC1JLVLISE0sUUjJLC7OLEgsyczPUyguKSpNLiktSlVIyy9SKM5PKylPBHJSUosz0_N4GFjTEnOKU3mhNDeDkptriLOHbmpBfnxqcUFicmpeakm8s5-RoamhobmJsWVoqDFRigCEIC9p</recordid><startdate>20211210</startdate><enddate>20211210</enddate><creator>LI XIANNA</creator><creator>YUE TENGFEI</creator><creator>WANG LIXIANG</creator><creator>JING FANG</creator><creator>LIU JIANWEI</creator><scope>EVB</scope></search><sort><creationdate>20211210</creationdate><title>Computer heat dissipation structure for software design</title><author>LI XIANNA ; YUE TENGFEI ; WANG LIXIANG ; JING FANG ; LIU JIANWEI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN215117439UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2021</creationdate><topic>CALCULATING</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>PHYSICS</topic><toplevel>online_resources</toplevel><creatorcontrib>LI XIANNA</creatorcontrib><creatorcontrib>YUE TENGFEI</creatorcontrib><creatorcontrib>WANG LIXIANG</creatorcontrib><creatorcontrib>JING FANG</creatorcontrib><creatorcontrib>LIU JIANWEI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LI XIANNA</au><au>YUE TENGFEI</au><au>WANG LIXIANG</au><au>JING FANG</au><au>LIU JIANWEI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Computer heat dissipation structure for software design</title><date>2021-12-10</date><risdate>2021</risdate><abstract>The utility model discloses a computer heat dissipation structure for software design, and relates to the field of computers. The computer heat dissipation structure for software design comprises a computer main body, and heat dissipation holes are formed in the bottom of the computer main body; the telescopic mechanism comprises a connecting plate, and the connecting plate is rotationally connected to the bottom of the computer body through a rotating shaft. According to the computer heat dissipation structure for software design, the heat dissipation holes are formed in the bottom of the computer body, the heat dissipation area is increased, and the connecting plate and the computer body are in an inclined state by setting the connecting relation among the connecting block, the rotating plate, the supporting plate, the sliding block, the fixed block, the moving groove, the fixed plate, the limiting column and the limiting hook; the bottom of the computer is prevented from being attached to the desktop, the</abstract><oa>free_for_read</oa></addata></record> |
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language | chi ; eng |
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subjects | CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING PHYSICS |
title | Computer heat dissipation structure for software design |
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