Intelligent system for dynamically measuring micro stress in solidification process of optical element bonding glue
The utility model discloses an intelligent system for dynamically measuring micro stress in a solidification process of glue for bonding optical elements. The system comprises a mechanical sensing system, a data acquisition and signal processing system and a result analysis and display system, accor...
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| creator | SHU LINSEN ZHAO LIANG LI HUA WANG PENG KANG SHIFA CHEN YANLONG WANG JIASHENG ZHENG XIANGKE |
| description | The utility model discloses an intelligent system for dynamically measuring micro stress in a solidification process of glue for bonding optical elements. The system comprises a mechanical sensing system, a data acquisition and signal processing system and a result analysis and display system, according to the utility model, the variation trend of dynamic micro-stress and environment temperature can be obviously displayed, and the difficulty in stress measurement data output and analysis processing is overcome.
本实用新型公开光学元件黏接用胶的凝固过程微应力动态测量智能系统，系统包括机械感知系统、数据采集及信号处理系统、结果分析及显示系统；本实用新型可明显地显示动态微应力和环境温度的变化趋势，克服了应力测量数据输出与分析处理的困难。 |
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本实用新型公开光学元件黏接用胶的凝固过程微应力动态测量智能系统，系统包括机械感知系统、数据采集及信号处理系统、结果分析及显示系统；本实用新型可明显地显示动态微应力和环境温度的变化趋势，克服了应力测量数据输出与分析处理的困难。</description><language>chi ; eng</language><subject>MEASURING ; MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE ; MEASURING QUANTITY OF HEAT ; MEASURING TEMPERATURE ; PHYSICS ; TESTING ; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211126&DB=EPODOC&CC=CN&NR=214893796U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211126&DB=EPODOC&CC=CN&NR=214893796U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SHU LINSEN</creatorcontrib><creatorcontrib>ZHAO LIANG</creatorcontrib><creatorcontrib>LI HUA</creatorcontrib><creatorcontrib>WANG PENG</creatorcontrib><creatorcontrib>KANG SHIFA</creatorcontrib><creatorcontrib>CHEN YANLONG</creatorcontrib><creatorcontrib>WANG JIASHENG</creatorcontrib><creatorcontrib>ZHENG XIANGKE</creatorcontrib><title>Intelligent system for dynamically measuring micro stress in solidification process of optical element bonding glue</title><description>The utility model discloses an intelligent system for dynamically measuring micro stress in a solidification process of glue for bonding optical elements. The system comprises a mechanical sensing system, a data acquisition and signal processing system and a result analysis and display system, according to the utility model, the variation trend of dynamic micro-stress and environment temperature can be obviously displayed, and the difficulty in stress measurement data output and analysis processing is overcome.
本实用新型公开光学元件黏接用胶的凝固过程微应力动态测量智能系统，系统包括机械感知系统、数据采集及信号处理系统、结果分析及显示系统；本实用新型可明显地显示动态微应力和环境温度的变化趋势，克服了应力测量数据输出与分析处理的困难。</description><subject>MEASURING</subject><subject>MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE</subject><subject>MEASURING QUANTITY OF HEAT</subject><subject>MEASURING TEMPERATURE</subject><subject>PHYSICS</subject><subject>TESTING</subject><subject>THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjLEOwjAMRLswIOAfLHYGKIJ2rkCwMNG5Cq1TRXLsKE6H_j2NxAcwnXT37q0LfXJCIjciJ9BZE3qwEmGY2XjXG6IZPBqdouMRliYKaIqoCo5Bhdzg7MIlJwwhSp8XsSAh5Tcgoc_qj_CQDSNNuC1W1pDi7pebYn-_vZvHAYN0qMH0yJi65nU6nqu6vNaXti3_gr5_I0Z7</recordid><startdate>20211126</startdate><enddate>20211126</enddate><creator>SHU LINSEN</creator><creator>ZHAO LIANG</creator><creator>LI HUA</creator><creator>WANG PENG</creator><creator>KANG SHIFA</creator><creator>CHEN YANLONG</creator><creator>WANG JIASHENG</creator><creator>ZHENG XIANGKE</creator><scope>EVB</scope></search><sort><creationdate>20211126</creationdate><title>Intelligent system for dynamically measuring micro stress in solidification process of optical element bonding glue</title><author>SHU LINSEN ; ZHAO LIANG ; LI HUA ; WANG PENG ; KANG SHIFA ; CHEN YANLONG ; WANG JIASHENG ; ZHENG XIANGKE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN214893796UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2021</creationdate><topic>MEASURING</topic><topic>MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE</topic><topic>MEASURING QUANTITY OF HEAT</topic><topic>MEASURING TEMPERATURE</topic><topic>PHYSICS</topic><topic>TESTING</topic><topic>THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR</topic><toplevel>online_resources</toplevel><creatorcontrib>SHU LINSEN</creatorcontrib><creatorcontrib>ZHAO LIANG</creatorcontrib><creatorcontrib>LI HUA</creatorcontrib><creatorcontrib>WANG PENG</creatorcontrib><creatorcontrib>KANG SHIFA</creatorcontrib><creatorcontrib>CHEN YANLONG</creatorcontrib><creatorcontrib>WANG JIASHENG</creatorcontrib><creatorcontrib>ZHENG XIANGKE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SHU LINSEN</au><au>ZHAO LIANG</au><au>LI HUA</au><au>WANG PENG</au><au>KANG SHIFA</au><au>CHEN YANLONG</au><au>WANG JIASHENG</au><au>ZHENG XIANGKE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Intelligent system for dynamically measuring micro stress in solidification process of optical element bonding glue</title><date>2021-11-26</date><risdate>2021</risdate><abstract>The utility model discloses an intelligent system for dynamically measuring micro stress in a solidification process of glue for bonding optical elements. The system comprises a mechanical sensing system, a data acquisition and signal processing system and a result analysis and display system, according to the utility model, the variation trend of dynamic micro-stress and environment temperature can be obviously displayed, and the difficulty in stress measurement data output and analysis processing is overcome.
本实用新型公开光学元件黏接用胶的凝固过程微应力动态测量智能系统，系统包括机械感知系统、数据采集及信号处理系统、结果分析及显示系统；本实用新型可明显地显示动态微应力和环境温度的变化趋势，克服了应力测量数据输出与分析处理的困难。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | MEASURING MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE MEASURING QUANTITY OF HEAT MEASURING TEMPERATURE PHYSICS TESTING THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR |
| title | Intelligent system for dynamically measuring micro stress in solidification process of optical element bonding glue |
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