Heat dissipation device for cabinet

A heat dissipation device for a cabinet comprises a shell, a cold air hose, a hot air hose, a first fan, a second fan, two sets of conduction supports, a semiconductor chilling plate, a first heat conduction copper bar and a second heat conduction copper bar. An air inlet hole is formed in the shell...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: GAO DING, CAO SHIJING, SUN KAI, GAO RUI, TONG JINGHUI, SU JING, PAN WEI, WANG BIN, HOU ZHUYU, DU YU, LI XIAOSHUN, CHENG PENG, YU SHANSHAN, ZHANG YU, ZHAO HAISEN
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:A heat dissipation device for a cabinet comprises a shell, a cold air hose, a hot air hose, a first fan, a second fan, two sets of conduction supports, a semiconductor chilling plate, a first heat conduction copper bar and a second heat conduction copper bar. An air inlet hole is formed in the shell; the first draught fan and the second draught fan are distributed side by side and installed in the shell, and air outlet ports of the first draught fan and the second draught fan communicate with the outside of the shell. Air outlet ports of the first fan and the second fan are respectively connected with a cold air hose and a hot air hose; a clearance space for mounting the semiconductor chilling plate is reserved between the two groups of conduction brackets; the hot end and the cold end of the semiconductor chilling plate respectively press the two groups of conduction brackets; the conduction bracket is connected with the inner wall of the shell; the two sets of conduction supports are connected with the oute