Antenna chip packaging structure

The utility model provides an antenna chip packaging structure. The antenna chip packaging structure comprises a rewiring layer; the first antenna layer is located above the rewiring layer and connected with the rewiring layer; the first connecting structure is connected with the first antenna layer...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	XUE YAYUAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ANTENNAS, i.e. RADIO AERIALS BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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