Antenna chip packaging structure

The utility model provides an antenna chip packaging structure. The antenna chip packaging structure comprises a rewiring layer; the first antenna layer is located above the rewiring layer and connected with the rewiring layer; the first connecting structure is connected with the first antenna layer; the first packaging layer covers the rewiring layer, the first antenna layer and the first connecting structure; the second antenna layer is located above the first packaging layer and connected with the first connecting structure; the second connecting structure is connected with the second antenna layer; the second packaging layer covers the first packaging layer, the second antenna layer and the second connecting structure; the bump lower metal layer is positioned below the rewiring layer; and the solder ball and the chip are connected with the bump lower metal layer. According to the utility model, by introducing a multi-layer antenna layer structure, the size of the packaging structure is reduced; laser dril