Packaging die
A packaging die comprises a die body, two first cavities and a plurality of second cavities. The mold body is provided with at least one mold sealing area. The two first cavities are connected with the mold body, each first cavity is provided with a containing cavity and at least one connecting chan...
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| creator | ZENG YIXIU JIAN ZIJIE CHEN XIHONG |
| description | A packaging die comprises a die body, two first cavities and a plurality of second cavities. The mold body is provided with at least one mold sealing area. The two first cavities are connected with the mold body, each first cavity is provided with a containing cavity and at least one connecting channel, and the connecting channels are communicated with the mold sealing area and the containing cavity. The second cavities are connected with the mold body, each second cavity is provided with a material containing cavity and at least one feeding and pouring channel, and the feeding and pouring channels are communicated with the mold sealing area and the material containing cavities. And the volume of the connecting channel of the first cavity is greater than or equal to the volume of the charging pouring channel of the second cavity.
一种封装模具包括模具本体、两个第一腔体及多个第二腔体。所述模具本体具有至少一个模封区。所述两个第一腔体连接所述模具本体，每一所述第一腔体具有容置腔及至少一个连接通道，且所述连接通道连通所述模封区及所述容置腔。所述第二腔体连接所述模具本体，每一所述第二腔体具有置料腔及至少一个加料浇注通道，且所述加料浇注通道连通所述模封区及所述置料腔。所述第一腔体的所述连接通道的容 |
| format | Patent |
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一种封装模具包括模具本体、两个第一腔体及多个第二腔体。所述模具本体具有至少一个模封区。所述两个第一腔体连接所述模具本体，每一所述第一腔体具有容置腔及至少一个连接通道，且所述连接通道连通所述模封区及所述容置腔。所述第二腔体连接所述模具本体，每一所述第二腔体具有置料腔及至少一个加料浇注通道，且所述加料浇注通道连通所述模封区及所述置料腔。所述第一腔体的所述连接通道的容</description><language>chi ; eng</language><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ; BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR ; SHAPING OR JOINING OF PLASTICS ; TRANSPORTING ; WORKING OF PLASTICS ; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210115&DB=EPODOC&CC=CN&NR=212352724U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210115&DB=EPODOC&CC=CN&NR=212352724U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ZENG YIXIU</creatorcontrib><creatorcontrib>JIAN ZIJIE</creatorcontrib><creatorcontrib>CHEN XIHONG</creatorcontrib><title>Packaging die</title><description>A packaging die comprises a die body, two first cavities and a plurality of second cavities. The mold body is provided with at least one mold sealing area. The two first cavities are connected with the mold body, each first cavity is provided with a containing cavity and at least one connecting channel, and the connecting channels are communicated with the mold sealing area and the containing cavity. The second cavities are connected with the mold body, each second cavity is provided with a material containing cavity and at least one feeding and pouring channel, and the feeding and pouring channels are communicated with the mold sealing area and the material containing cavities. And the volume of the connecting channel of the first cavity is greater than or equal to the volume of the charging pouring channel of the second cavity.
一种封装模具包括模具本体、两个第一腔体及多个第二腔体。所述模具本体具有至少一个模封区。所述两个第一腔体连接所述模具本体，每一所述第一腔体具有容置腔及至少一个连接通道，且所述连接通道连通所述模封区及所述容置腔。所述第二腔体连接所述模具本体，每一所述第二腔体具有置料腔及至少一个加料浇注通道，且所述加料浇注通道连通所述模封区及所述置料腔。所述第一腔体的所述连接通道的容</description><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>PERFORMING OPERATIONS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</subject><subject>SHAPING OR JOINING OF PLASTICS</subject><subject>TRANSPORTING</subject><subject>WORKING OF PLASTICS</subject><subject>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOANSEzOTkzPzEtXSMlM5WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8c5-RoZGxqZG5kYmoaHGRCkCAFnBHpc</recordid><startdate>20210115</startdate><enddate>20210115</enddate><creator>ZENG YIXIU</creator><creator>JIAN ZIJIE</creator><creator>CHEN XIHONG</creator><scope>EVB</scope></search><sort><creationdate>20210115</creationdate><title>Packaging die</title><author>ZENG YIXIU ; JIAN ZIJIE ; CHEN XIHONG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN212352724UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2021</creationdate><topic>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>PERFORMING OPERATIONS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</topic><topic>SHAPING OR JOINING OF PLASTICS</topic><topic>TRANSPORTING</topic><topic>WORKING OF PLASTICS</topic><topic>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</topic><toplevel>online_resources</toplevel><creatorcontrib>ZENG YIXIU</creatorcontrib><creatorcontrib>JIAN ZIJIE</creatorcontrib><creatorcontrib>CHEN XIHONG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ZENG YIXIU</au><au>JIAN ZIJIE</au><au>CHEN XIHONG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Packaging die</title><date>2021-01-15</date><risdate>2021</risdate><abstract>A packaging die comprises a die body, two first cavities and a plurality of second cavities. The mold body is provided with at least one mold sealing area. The two first cavities are connected with the mold body, each first cavity is provided with a containing cavity and at least one connecting channel, and the connecting channels are communicated with the mold sealing area and the containing cavity. The second cavities are connected with the mold body, each second cavity is provided with a material containing cavity and at least one feeding and pouring channel, and the feeding and pouring channels are communicated with the mold sealing area and the material containing cavities. And the volume of the connecting channel of the first cavity is greater than or equal to the volume of the charging pouring channel of the second cavity.
一种封装模具包括模具本体、两个第一腔体及多个第二腔体。所述模具本体具有至少一个模封区。所述两个第一腔体连接所述模具本体，每一所述第一腔体具有容置腔及至少一个连接通道，且所述连接通道连通所述模封区及所述容置腔。所述第二腔体连接所述模具本体，每一所述第二腔体具有置料腔及至少一个加料浇注通道，且所述加料浇注通道连通所述模封区及所述置料腔。所述第一腔体的所述连接通道的容</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL |
| title | Packaging die |
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