And photovoltaic bypass diode module unit
And a photovoltaic bypass diode module unit. The invention relates to the technical field of semiconductor chip packaging, in particular to an improvement of an optical module type photovoltaic diodestructure. The photovoltaic bypass diode module unit is clear in polarity, convenient to identify and...
Gespeichert in:
| Hauptverfasser: | , , , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | ZHOU LIMING XIAO BAOTONG WANG YI JING CHANGZHONG |
| description | And a photovoltaic bypass diode module unit. The invention relates to the technical field of semiconductor chip packaging, in particular to an improvement of an optical module type photovoltaic diodestructure. The photovoltaic bypass diode module unit is clear in polarity, convenient to identify and good in heat dissipation performance. The diode comprises a first frame, a second frame, a chip, ajumper wire and a packaging body, the chip is fixedly welded to the second frame, the jumper wire connects the chip with the first frame to form a diode one-way conduction circuit, the packaging bodyseals the chip and the jumper wire, the packaging body is in a U shape or a C shape, and the packaging body is in a U shape or a C shape. The opening direction of the U-shaped or C-shaped packaging body faces the first frame. According to the utility model, the product is provided with the heat dissipation metal sheet (the heat sink body), so that the heat dissipation effect and the current capacity are improved.
光伏旁路二极管模块 |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN212277175UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN212277175UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN212277175UU3</originalsourceid><addsrcrecordid>eNrjZNB0zEtRKMjIL8kvy88pScxMVkiqLEgsLlZIycxPSVXIzU8pzUlVKM3LLOFhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfHOfkaGRkbm5obmpqGhxkQpAgBg4imU</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>And photovoltaic bypass diode module unit</title><source>esp@cenet</source><creator>ZHOU LIMING ; XIAO BAOTONG ; WANG YI ; JING CHANGZHONG</creator><creatorcontrib>ZHOU LIMING ; XIAO BAOTONG ; WANG YI ; JING CHANGZHONG</creatorcontrib><description>And a photovoltaic bypass diode module unit. The invention relates to the technical field of semiconductor chip packaging, in particular to an improvement of an optical module type photovoltaic diodestructure. The photovoltaic bypass diode module unit is clear in polarity, convenient to identify and good in heat dissipation performance. The diode comprises a first frame, a second frame, a chip, ajumper wire and a packaging body, the chip is fixedly welded to the second frame, the jumper wire connects the chip with the first frame to form a diode one-way conduction circuit, the packaging bodyseals the chip and the jumper wire, the packaging body is in a U shape or a C shape, and the packaging body is in a U shape or a C shape. The opening direction of the U-shaped or C-shaped packaging body faces the first frame. According to the utility model, the product is provided with the heat dissipation metal sheet (the heat sink body), so that the heat dissipation effect and the current capacity are improved.
光伏旁路二极管模块</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERATION ; GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRA-REDRADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, E.G. USINGPHOTOVOLTAIC [PV] MODULES ; SEMICONDUCTOR DEVICES</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210101&DB=EPODOC&CC=CN&NR=212277175U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76419</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210101&DB=EPODOC&CC=CN&NR=212277175U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ZHOU LIMING</creatorcontrib><creatorcontrib>XIAO BAOTONG</creatorcontrib><creatorcontrib>WANG YI</creatorcontrib><creatorcontrib>JING CHANGZHONG</creatorcontrib><title>And photovoltaic bypass diode module unit</title><description>And a photovoltaic bypass diode module unit. The invention relates to the technical field of semiconductor chip packaging, in particular to an improvement of an optical module type photovoltaic diodestructure. The photovoltaic bypass diode module unit is clear in polarity, convenient to identify and good in heat dissipation performance. The diode comprises a first frame, a second frame, a chip, ajumper wire and a packaging body, the chip is fixedly welded to the second frame, the jumper wire connects the chip with the first frame to form a diode one-way conduction circuit, the packaging bodyseals the chip and the jumper wire, the packaging body is in a U shape or a C shape, and the packaging body is in a U shape or a C shape. The opening direction of the U-shaped or C-shaped packaging body faces the first frame. According to the utility model, the product is provided with the heat dissipation metal sheet (the heat sink body), so that the heat dissipation effect and the current capacity are improved.
光伏旁路二极管模块</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CONVERSION OR DISTRIBUTION OF ELECTRIC POWER</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERATION</subject><subject>GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRA-REDRADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, E.G. USINGPHOTOVOLTAIC [PV] MODULES</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNB0zEtRKMjIL8kvy88pScxMVkiqLEgsLlZIycxPSVXIzU8pzUlVKM3LLOFhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfHOfkaGRkbm5obmpqGhxkQpAgBg4imU</recordid><startdate>20210101</startdate><enddate>20210101</enddate><creator>ZHOU LIMING</creator><creator>XIAO BAOTONG</creator><creator>WANG YI</creator><creator>JING CHANGZHONG</creator><scope>EVB</scope></search><sort><creationdate>20210101</creationdate><title>And photovoltaic bypass diode module unit</title><author>ZHOU LIMING ; XIAO BAOTONG ; WANG YI ; JING CHANGZHONG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN212277175UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CONVERSION OR DISTRIBUTION OF ELECTRIC POWER</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERATION</topic><topic>GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRA-REDRADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, E.G. USINGPHOTOVOLTAIC [PV] MODULES</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>ZHOU LIMING</creatorcontrib><creatorcontrib>XIAO BAOTONG</creatorcontrib><creatorcontrib>WANG YI</creatorcontrib><creatorcontrib>JING CHANGZHONG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ZHOU LIMING</au><au>XIAO BAOTONG</au><au>WANG YI</au><au>JING CHANGZHONG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>And photovoltaic bypass diode module unit</title><date>2021-01-01</date><risdate>2021</risdate><abstract>And a photovoltaic bypass diode module unit. The invention relates to the technical field of semiconductor chip packaging, in particular to an improvement of an optical module type photovoltaic diodestructure. The photovoltaic bypass diode module unit is clear in polarity, convenient to identify and good in heat dissipation performance. The diode comprises a first frame, a second frame, a chip, ajumper wire and a packaging body, the chip is fixedly welded to the second frame, the jumper wire connects the chip with the first frame to form a diode one-way conduction circuit, the packaging bodyseals the chip and the jumper wire, the packaging body is in a U shape or a C shape, and the packaging body is in a U shape or a C shape. The opening direction of the U-shaped or C-shaped packaging body faces the first frame. According to the utility model, the product is provided with the heat dissipation metal sheet (the heat sink body), so that the heat dissipation effect and the current capacity are improved.
光伏旁路二极管模块</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN212277175UU |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRA-REDRADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, E.G. USINGPHOTOVOLTAIC [PV] MODULES SEMICONDUCTOR DEVICES |
| title | And photovoltaic bypass diode module unit |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-08T06%3A13%3A42IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=ZHOU%20LIMING&rft.date=2021-01-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN212277175UU%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |