Piezoelectric ceramic filter packaging structure

The utility model discloses a piezoelectric ceramic filter packaging structure comprising an alumina ceramic block packaged in a housing, the alumina ceramic block comprises a circuit break area and acircuit area formed by a metal conductive layer, and the metal conductive layer is also connected wi...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: YANG CHAO, DUAN NA, ZHANG YING, LIU JIANXUE, WU LUOSHU, WANG MINGJUN, ZHANG WENSHENG
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator YANG CHAO
DUAN NA
ZHANG YING
LIU JIANXUE
WU LUOSHU
WANG MINGJUN
ZHANG WENSHENG
description The utility model discloses a piezoelectric ceramic filter packaging structure comprising an alumina ceramic block packaged in a housing, the alumina ceramic block comprises a circuit break area and acircuit area formed by a metal conductive layer, and the metal conductive layer is also connected with a guide pillar pedestal extending out of the housing; a middle groove is formed in the aluminumoxide ceramic block, the multiple electrode convex grooves are symmetrically distributed in the two sides of the middle groove, guide holes are formed in the electrode convex grooves, and the guide holes are internally covered with metal conductive films communicating with the metal conductive layer; piezoelectric ceramic vibrators are arranged on the two side faces of the two symmetrical electrode convex grooves, and electrodes and vibrator bonding pads are arranged on the two sides of the piezoelectric ceramic vibrators. And the oscillator bonding pad is connected with the metal conductive layer through a bonding pad
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN212258921UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN212258921UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN212258921UU3</originalsourceid><addsrcrecordid>eNrjZDAIyEytyk_NSU0uKcpMVkhOLUrMBdJpmTklqUUKBYnJ2YnpmXnpCsUlRaXJJaVFqTwMrGmJOcWpvFCam0HJzTXE2UM3tSA_PrUYqCM1L7Uk3tnPyNDIyNTC0sgwNNSYKEUA-5AsrQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Piezoelectric ceramic filter packaging structure</title><source>esp@cenet</source><creator>YANG CHAO ; DUAN NA ; ZHANG YING ; LIU JIANXUE ; WU LUOSHU ; WANG MINGJUN ; ZHANG WENSHENG</creator><creatorcontrib>YANG CHAO ; DUAN NA ; ZHANG YING ; LIU JIANXUE ; WU LUOSHU ; WANG MINGJUN ; ZHANG WENSHENG</creatorcontrib><description>The utility model discloses a piezoelectric ceramic filter packaging structure comprising an alumina ceramic block packaged in a housing, the alumina ceramic block comprises a circuit break area and acircuit area formed by a metal conductive layer, and the metal conductive layer is also connected with a guide pillar pedestal extending out of the housing; a middle groove is formed in the aluminumoxide ceramic block, the multiple electrode convex grooves are symmetrically distributed in the two sides of the middle groove, guide holes are formed in the electrode convex grooves, and the guide holes are internally covered with metal conductive films communicating with the metal conductive layer; piezoelectric ceramic vibrators are arranged on the two side faces of the two symmetrical electrode convex grooves, and electrodes and vibrator bonding pads are arranged on the two sides of the piezoelectric ceramic vibrators. And the oscillator bonding pad is connected with the metal conductive layer through a bonding pad</description><language>chi ; eng</language><subject>BASIC ELECTRONIC CIRCUITRY ; ELECTRICITY ; IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS ; RESONATORS</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20201229&amp;DB=EPODOC&amp;CC=CN&amp;NR=212258921U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20201229&amp;DB=EPODOC&amp;CC=CN&amp;NR=212258921U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YANG CHAO</creatorcontrib><creatorcontrib>DUAN NA</creatorcontrib><creatorcontrib>ZHANG YING</creatorcontrib><creatorcontrib>LIU JIANXUE</creatorcontrib><creatorcontrib>WU LUOSHU</creatorcontrib><creatorcontrib>WANG MINGJUN</creatorcontrib><creatorcontrib>ZHANG WENSHENG</creatorcontrib><title>Piezoelectric ceramic filter packaging structure</title><description>The utility model discloses a piezoelectric ceramic filter packaging structure comprising an alumina ceramic block packaged in a housing, the alumina ceramic block comprises a circuit break area and acircuit area formed by a metal conductive layer, and the metal conductive layer is also connected with a guide pillar pedestal extending out of the housing; a middle groove is formed in the aluminumoxide ceramic block, the multiple electrode convex grooves are symmetrically distributed in the two sides of the middle groove, guide holes are formed in the electrode convex grooves, and the guide holes are internally covered with metal conductive films communicating with the metal conductive layer; piezoelectric ceramic vibrators are arranged on the two side faces of the two symmetrical electrode convex grooves, and electrodes and vibrator bonding pads are arranged on the two sides of the piezoelectric ceramic vibrators. And the oscillator bonding pad is connected with the metal conductive layer through a bonding pad</description><subject>BASIC ELECTRONIC CIRCUITRY</subject><subject>ELECTRICITY</subject><subject>IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS</subject><subject>RESONATORS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAIyEytyk_NSU0uKcpMVkhOLUrMBdJpmTklqUUKBYnJ2YnpmXnpCsUlRaXJJaVFqTwMrGmJOcWpvFCam0HJzTXE2UM3tSA_PrUYqCM1L7Uk3tnPyNDIyNTC0sgwNNSYKEUA-5AsrQ</recordid><startdate>20201229</startdate><enddate>20201229</enddate><creator>YANG CHAO</creator><creator>DUAN NA</creator><creator>ZHANG YING</creator><creator>LIU JIANXUE</creator><creator>WU LUOSHU</creator><creator>WANG MINGJUN</creator><creator>ZHANG WENSHENG</creator><scope>EVB</scope></search><sort><creationdate>20201229</creationdate><title>Piezoelectric ceramic filter packaging structure</title><author>YANG CHAO ; DUAN NA ; ZHANG YING ; LIU JIANXUE ; WU LUOSHU ; WANG MINGJUN ; ZHANG WENSHENG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN212258921UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2020</creationdate><topic>BASIC ELECTRONIC CIRCUITRY</topic><topic>ELECTRICITY</topic><topic>IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS</topic><topic>RESONATORS</topic><toplevel>online_resources</toplevel><creatorcontrib>YANG CHAO</creatorcontrib><creatorcontrib>DUAN NA</creatorcontrib><creatorcontrib>ZHANG YING</creatorcontrib><creatorcontrib>LIU JIANXUE</creatorcontrib><creatorcontrib>WU LUOSHU</creatorcontrib><creatorcontrib>WANG MINGJUN</creatorcontrib><creatorcontrib>ZHANG WENSHENG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YANG CHAO</au><au>DUAN NA</au><au>ZHANG YING</au><au>LIU JIANXUE</au><au>WU LUOSHU</au><au>WANG MINGJUN</au><au>ZHANG WENSHENG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Piezoelectric ceramic filter packaging structure</title><date>2020-12-29</date><risdate>2020</risdate><abstract>The utility model discloses a piezoelectric ceramic filter packaging structure comprising an alumina ceramic block packaged in a housing, the alumina ceramic block comprises a circuit break area and acircuit area formed by a metal conductive layer, and the metal conductive layer is also connected with a guide pillar pedestal extending out of the housing; a middle groove is formed in the aluminumoxide ceramic block, the multiple electrode convex grooves are symmetrically distributed in the two sides of the middle groove, guide holes are formed in the electrode convex grooves, and the guide holes are internally covered with metal conductive films communicating with the metal conductive layer; piezoelectric ceramic vibrators are arranged on the two side faces of the two symmetrical electrode convex grooves, and electrodes and vibrator bonding pads are arranged on the two sides of the piezoelectric ceramic vibrators. And the oscillator bonding pad is connected with the metal conductive layer through a bonding pad</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_CN212258921UU
source esp@cenet
subjects BASIC ELECTRONIC CIRCUITRY
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
RESONATORS
title Piezoelectric ceramic filter packaging structure
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-30T13%3A05%3A54IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=YANG%20CHAO&rft.date=2020-12-29&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN212258921UU%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true