Material ring selective positioning device for semiconductor film sticking machine

The utility model discloses a material ring selective positioning device for a semiconductor film sticking machine, which is characterized in that a film sticking working surface is provided with a first positioning ring and a second positioning ring which are not equal in outer diameter and are con...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: GE ZIPING, HU ZHANGKUN, WU YINGJIE, YANG YUNLONG
Format: Patent
Sprache:chi ; eng
Schlagworte:
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