Material ring selective positioning device for semiconductor film sticking machine
The utility model discloses a material ring selective positioning device for a semiconductor film sticking machine, which is characterized in that a film sticking working surface is provided with a first positioning ring and a second positioning ring which are not equal in outer diameter and are con...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model discloses a material ring selective positioning device for a semiconductor film sticking machine, which is characterized in that a film sticking working surface is provided with a first positioning ring and a second positioning ring which are not equal in outer diameter and are concentrically arranged with a working limiting disc, and each positioning ring at least comprises a first positioning hole and a second positioning hole which are positioned, installed and matched with the material ring and are arranged at intervals; a first plug-in mounting positioning driving assembly corresponding to the first positioning hole and the second positioning hole and in selective plug-in mounting positioning fit with the first positioning ring is arranged below the first positioningring; a second plug-in mounting positioning driving assembly corresponding to the first positioning hole and the second positioning hole and in selective plug-in mounting positioning fit with the first positioning hole and t |
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