AI server with good heat dissipation performance
The utility model relates to the technical field of network equipment. The utility model relates to an AI server, in particular to an AI server with good heat dissipation performance. The device comprises a shell mechanism, a connecting plate is fixedly installed at the bottom of one side of the she...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model relates to the technical field of network equipment. The utility model relates to an AI server, in particular to an AI server with good heat dissipation performance. The device comprises a shell mechanism, a connecting plate is fixedly installed at the bottom of one side of the shell mechanism, the shell mechanism is fixedly installed with a heat dissipation mechanism through theconnecting plate arranged at the bottom of one side of the shell mechanism, a CPU module and a GPU module are slidably connected to the interior of the shell mechanism, and a sealing cover mechanismis fixedly installed at the top of the shell mechanism. The utility model discloses an AI server with good heat dissipation performance. The air inlet hole is formed in the bottom of the machine shell. The heat dissipation holes are formed in the top of the cover plate; the heat is dissipated from the bottom to the top of the shell; hot gas is prevented from being gathered at the tops of the CPU module and the GPU module; |
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