Tungsten-copper preset gold-tin solder heat sink
The utility model relates to a tungsten-copper preset gold-tin solder heat sink which comprises a tungsten-copper block, the tungsten-copper block is of a cuboid structure, a nickel layer is arrangedon the periphery of the tungsten-copper block, a gold layer is arranged outside the nickel layer, pre...
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| creator | HAN JIANDONG BIAO JUN ZHI YUNTAO |
| description | The utility model relates to a tungsten-copper preset gold-tin solder heat sink which comprises a tungsten-copper block, the tungsten-copper block is of a cuboid structure, a nickel layer is arrangedon the periphery of the tungsten-copper block, a gold layer is arranged outside the nickel layer, preset gold-tin solder is arranged at the upper end of the gold layer, and the preset gold-tin solderis arranged at the upper end of the gold layer in a layered electroplating mode. By arranging the preset gold-tin solder on a traditional tungsten-copper heat sink, the step of clamping the solder when the tungsten-copper heat sink is used is omitted, the solder does not need to be placed at the sintering position of a chip after being clamped, and the step process is simplified.
本实用新型涉及一种钨铜预置金锡焊料热沉，包括钨铜块，所述钨铜块为长方体结构，所述钨铜块的外周设置镍层，所述镍层外设置金层，其中，所述金层的上端设置预置金锡焊料，所述预置金锡焊料通过分层电镀的方式设置在所述金层上端。通过在传统的钨铜热沉上设置预置金锡焊料，省去了钨铜热沉使用时夹取焊料的步骤，且不需要夹取焊料后，要将焊料放到芯片烧结的位置，简化了步骤工艺。 |
| format | Patent |
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本实用新型涉及一种钨铜预置金锡焊料热沉，包括钨铜块，所述钨铜块为长方体结构，所述钨铜块的外周设置镍层，所述镍层外设置金层，其中，所述金层的上端设置预置金锡焊料，所述预置金锡焊料通过分层电镀的方式设置在所述金层上端。通过在传统的钨铜热沉上设置预置金锡焊料，省去了钨铜热沉使用时夹取焊料的步骤，且不需要夹取焊料后，要将焊料放到芯片烧结的位置，简化了步骤工艺。</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201124&DB=EPODOC&CC=CN&NR=212010948U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201124&DB=EPODOC&CC=CN&NR=212010948U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HAN JIANDONG</creatorcontrib><creatorcontrib>BIAO JUN</creatorcontrib><creatorcontrib>ZHI YUNTAO</creatorcontrib><title>Tungsten-copper preset gold-tin solder heat sink</title><description>The utility model relates to a tungsten-copper preset gold-tin solder heat sink which comprises a tungsten-copper block, the tungsten-copper block is of a cuboid structure, a nickel layer is arrangedon the periphery of the tungsten-copper block, a gold layer is arranged outside the nickel layer, preset gold-tin solder is arranged at the upper end of the gold layer, and the preset gold-tin solderis arranged at the upper end of the gold layer in a layered electroplating mode. By arranging the preset gold-tin solder on a traditional tungsten-copper heat sink, the step of clamping the solder when the tungsten-copper heat sink is used is omitted, the solder does not need to be placed at the sintering position of a chip after being clamped, and the step process is simplified.
本实用新型涉及一种钨铜预置金锡焊料热沉，包括钨铜块，所述钨铜块为长方体结构，所述钨铜块的外周设置镍层，所述镍层外设置金层，其中，所述金层的上端设置预置金锡焊料，所述预置金锡焊料通过分层电镀的方式设置在所述金层上端。通过在传统的钨铜热沉上设置预置金锡焊料，省去了钨铜热沉使用时夹取焊料的步骤，且不需要夹取焊料后，要将焊料放到芯片烧结的位置，简化了步骤工艺。</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAIKc1LLy5JzdNNzi8oSC1SKChKLU4tUUjPz0nRLcnMUygGMoDCGamJJQrFmXnZPAysaYk5xam8UJqbQcnNNcTZQze1ID8-tbggMTk1L7Uk3tnPyNDIwNDA0sQiNNSYKEUAyY8sIA</recordid><startdate>20201124</startdate><enddate>20201124</enddate><creator>HAN JIANDONG</creator><creator>BIAO JUN</creator><creator>ZHI YUNTAO</creator><scope>EVB</scope></search><sort><creationdate>20201124</creationdate><title>Tungsten-copper preset gold-tin solder heat sink</title><author>HAN JIANDONG ; BIAO JUN ; ZHI YUNTAO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN212010948UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2020</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>HAN JIANDONG</creatorcontrib><creatorcontrib>BIAO JUN</creatorcontrib><creatorcontrib>ZHI YUNTAO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HAN JIANDONG</au><au>BIAO JUN</au><au>ZHI YUNTAO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Tungsten-copper preset gold-tin solder heat sink</title><date>2020-11-24</date><risdate>2020</risdate><abstract>The utility model relates to a tungsten-copper preset gold-tin solder heat sink which comprises a tungsten-copper block, the tungsten-copper block is of a cuboid structure, a nickel layer is arrangedon the periphery of the tungsten-copper block, a gold layer is arranged outside the nickel layer, preset gold-tin solder is arranged at the upper end of the gold layer, and the preset gold-tin solderis arranged at the upper end of the gold layer in a layered electroplating mode. By arranging the preset gold-tin solder on a traditional tungsten-copper heat sink, the step of clamping the solder when the tungsten-copper heat sink is used is omitted, the solder does not need to be placed at the sintering position of a chip after being clamped, and the step process is simplified.
本实用新型涉及一种钨铜预置金锡焊料热沉，包括钨铜块，所述钨铜块为长方体结构，所述钨铜块的外周设置镍层，所述镍层外设置金层，其中，所述金层的上端设置预置金锡焊料，所述预置金锡焊料通过分层电镀的方式设置在所述金层上端。通过在传统的钨铜热沉上设置预置金锡焊料，省去了钨铜热沉使用时夹取焊料的步骤，且不需要夹取焊料后，要将焊料放到芯片烧结的位置，简化了步骤工艺。</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN212010948UU |
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| subjects | BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | Tungsten-copper preset gold-tin solder heat sink |
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