Bonding layer structure

A bonding layer structure is disclosed. The present disclosure is a method of bonding an electrostatic chuck to a temperature control base. According to an embodiment, a bonding layer is formed between a dielectric body including an electrostatic chuck and a temperature control base. The flow apertu...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	VIJAY D.PARKHE, ROGER ALAN LINDLEY
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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