Pressure relief protection structure of semiconductor aging test equipment

The utility model discloses a pressure relief protection structure of semiconductor aging test equipment, which relates to the technical field of mechanical pressure protection, and comprises a compressed air branch I used for driving a thermal array to move close to a test board, and a compressed air branch II used for driving the thermal array to move and finally contacting the test board, the compressed air branch I and the compressed air branch II are both connected with an equipment pressure source, and the compressed air branch I and the compressed air branch II are each provided with apressure regulator, a regulating pressure release valve, an electromagnetic valve and an action execution unit for the thermal array. And the regulating pressure release valve comprises a pressure release valve which can set a pressure release threshold value and is arranged on the gas path through an adapter and a three-way joint. 本实用新型公开了一种半导体老化测试设备泄压保护结构，涉及机械压力保护技术领域，包括用于驱动热阵列动作靠近测试板的压缩空气支路Ⅰ，以及用于驱动热阵列动作并最终接触测试板的压缩空气支路Ⅱ