Mechanical wire harness manufacturing die capable of quickly forming

The utility model discloses a mechanical wire harness manufacturing die capable of being rapidly formed. The device comprises a wire harness mold and a baffle, a mounting frame is fixed to the middleof the wire harness mold, a forming protection frame is connected to the exterior of the wire harness...

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Hauptverfasser: WANG LEI, GUO SHIRU, ZHANG WEIJUN, ZHONG CONGHUA, WU CUIHONG
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Sprache:chi ; eng
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creator WANG LEI
GUO SHIRU
ZHANG WEIJUN
ZHONG CONGHUA
WU CUIHONG
description The utility model discloses a mechanical wire harness manufacturing die capable of being rapidly formed. The device comprises a wire harness mold and a baffle, a mounting frame is fixed to the middleof the wire harness mold, a forming protection frame is connected to the exterior of the wire harness mold, a heat dissipation pipeline is arranged in the forming protection frame, a sliding rod is connected to the top end of the mounting frame, a groove is formed in one side of the sliding rod, a sliding plate is fixed to the top of the groove, and a hollow plate is connected to the interior of the sliding plate. The utility model discloses a mechanical wire harness manufacturing mold capable of achieving rapid forming. The cooling holes in the forming protective frame are effectively and movably formed between the wire harness molds; the cooling gas in the heat dissipation pipeline can favorably pass through the space between the forming protection frame and the cooling hole; according to the cooling device, coo
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN210778038UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN210778038UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN210778038UU3</originalsourceid><addsrcrecordid>eNrjZHDxTU3OSMzLTE7MUSjPLEpVyEgsykstLlbITcwrTUtMLiktysxLV0jJTFVITixITMpJVchPUygszUzOzqlUSMsvygVK8zCwpiXmFKfyQmluBiU31xBnD93Ugvz41OKCxOTUvNSSeGc_I0MDc3MLA2OL0FBjohQBADQiM84</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Mechanical wire harness manufacturing die capable of quickly forming</title><source>esp@cenet</source><creator>WANG LEI ; GUO SHIRU ; ZHANG WEIJUN ; ZHONG CONGHUA ; WU CUIHONG</creator><creatorcontrib>WANG LEI ; GUO SHIRU ; ZHANG WEIJUN ; ZHONG CONGHUA ; WU CUIHONG</creatorcontrib><description>The utility model discloses a mechanical wire harness manufacturing die capable of being rapidly formed. The device comprises a wire harness mold and a baffle, a mounting frame is fixed to the middleof the wire harness mold, a forming protection frame is connected to the exterior of the wire harness mold, a heat dissipation pipeline is arranged in the forming protection frame, a sliding rod is connected to the top end of the mounting frame, a groove is formed in one side of the sliding rod, a sliding plate is fixed to the top of the groove, and a hollow plate is connected to the interior of the sliding plate. The utility model discloses a mechanical wire harness manufacturing mold capable of achieving rapid forming. The cooling holes in the forming protective frame are effectively and movably formed between the wire harness molds; the cooling gas in the heat dissipation pipeline can favorably pass through the space between the forming protection frame and the cooling hole; according to the cooling device, coo</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CABLES ; CONDUCTORS ; ELECTRICITY ; INSULATORS ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20200616&amp;DB=EPODOC&amp;CC=CN&amp;NR=210778038U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20200616&amp;DB=EPODOC&amp;CC=CN&amp;NR=210778038U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WANG LEI</creatorcontrib><creatorcontrib>GUO SHIRU</creatorcontrib><creatorcontrib>ZHANG WEIJUN</creatorcontrib><creatorcontrib>ZHONG CONGHUA</creatorcontrib><creatorcontrib>WU CUIHONG</creatorcontrib><title>Mechanical wire harness manufacturing die capable of quickly forming</title><description>The utility model discloses a mechanical wire harness manufacturing die capable of being rapidly formed. The device comprises a wire harness mold and a baffle, a mounting frame is fixed to the middleof the wire harness mold, a forming protection frame is connected to the exterior of the wire harness mold, a heat dissipation pipeline is arranged in the forming protection frame, a sliding rod is connected to the top end of the mounting frame, a groove is formed in one side of the sliding rod, a sliding plate is fixed to the top of the groove, and a hollow plate is connected to the interior of the sliding plate. The utility model discloses a mechanical wire harness manufacturing mold capable of achieving rapid forming. The cooling holes in the forming protective frame are effectively and movably formed between the wire harness molds; the cooling gas in the heat dissipation pipeline can favorably pass through the space between the forming protection frame and the cooling hole; according to the cooling device, coo</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CONDUCTORS</subject><subject>ELECTRICITY</subject><subject>INSULATORS</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHDxTU3OSMzLTE7MUSjPLEpVyEgsykstLlbITcwrTUtMLiktysxLV0jJTFVITixITMpJVchPUygszUzOzqlUSMsvygVK8zCwpiXmFKfyQmluBiU31xBnD93Ugvz41OKCxOTUvNSSeGc_I0MDc3MLA2OL0FBjohQBADQiM84</recordid><startdate>20200616</startdate><enddate>20200616</enddate><creator>WANG LEI</creator><creator>GUO SHIRU</creator><creator>ZHANG WEIJUN</creator><creator>ZHONG CONGHUA</creator><creator>WU CUIHONG</creator><scope>EVB</scope></search><sort><creationdate>20200616</creationdate><title>Mechanical wire harness manufacturing die capable of quickly forming</title><author>WANG LEI ; GUO SHIRU ; ZHANG WEIJUN ; ZHONG CONGHUA ; WU CUIHONG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN210778038UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2020</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CONDUCTORS</topic><topic>ELECTRICITY</topic><topic>INSULATORS</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><toplevel>online_resources</toplevel><creatorcontrib>WANG LEI</creatorcontrib><creatorcontrib>GUO SHIRU</creatorcontrib><creatorcontrib>ZHANG WEIJUN</creatorcontrib><creatorcontrib>ZHONG CONGHUA</creatorcontrib><creatorcontrib>WU CUIHONG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WANG LEI</au><au>GUO SHIRU</au><au>ZHANG WEIJUN</au><au>ZHONG CONGHUA</au><au>WU CUIHONG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Mechanical wire harness manufacturing die capable of quickly forming</title><date>2020-06-16</date><risdate>2020</risdate><abstract>The utility model discloses a mechanical wire harness manufacturing die capable of being rapidly formed. The device comprises a wire harness mold and a baffle, a mounting frame is fixed to the middleof the wire harness mold, a forming protection frame is connected to the exterior of the wire harness mold, a heat dissipation pipeline is arranged in the forming protection frame, a sliding rod is connected to the top end of the mounting frame, a groove is formed in one side of the sliding rod, a sliding plate is fixed to the top of the groove, and a hollow plate is connected to the interior of the sliding plate. The utility model discloses a mechanical wire harness manufacturing mold capable of achieving rapid forming. The cooling holes in the forming protective frame are effectively and movably formed between the wire harness molds; the cooling gas in the heat dissipation pipeline can favorably pass through the space between the forming protection frame and the cooling hole; according to the cooling device, coo</abstract><oa>free_for_read</oa></addata></record>
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language chi ; eng
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subjects BASIC ELECTRIC ELEMENTS
CABLES
CONDUCTORS
ELECTRICITY
INSULATORS
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
title Mechanical wire harness manufacturing die capable of quickly forming
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-22T12%3A23%3A01IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=WANG%20LEI&rft.date=2020-06-16&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN210778038UU%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true