Non-contact non-assembly integrated password board
The utility model discloses a non-contact non-assembly integrated password board which comprises an electronic module and an injection molding glue layer wrapping the outer side of the electronic module, the electronic module and the glue layer are of an integrated structure, the electronic module c...
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creator | WAN TIANJUN |
description | The utility model discloses a non-contact non-assembly integrated password board which comprises an electronic module and an injection molding glue layer wrapping the outer side of the electronic module, the electronic module and the glue layer are of an integrated structure, the electronic module comprises a non-contact antenna and a chip, and the chip is in lap joint with the non-contact antenna. According to the utility model, the password board with an integrated structure is obtained by injection molding of glue and the electronic module, and the non-contact antenna and the chip are directly added in the circuit of the electronic module, so that non-contact individuation of product functions is realized, the structure is simple and attractive, and efficient manufacturing and production are facilitated.
本实用新型公开了一种非接型非组装一体式口令牌,包括电子模组及包覆在所述电子模组外侧的注塑成型的胶水层,所述电子模组与胶水层为一体结构,所述电子模组包括非接天线和芯片,所述芯片与所述非接天线搭接。本实用新型采用胶水与电子模组注塑成型得到一体结构的口令牌,并在电子模组电路中直接加入非接天线和芯片,实现产品功能非接个性化,结构简洁美观,利于高效制作生产。 |
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本实用新型公开了一种非接型非组装一体式口令牌,包括电子模组及包覆在所述电子模组外侧的注塑成型的胶水层,所述电子模组与胶水层为一体结构,所述电子模组包括非接天线和芯片,所述芯片与所述非接天线搭接。本实用新型采用胶水与电子模组注塑成型得到一体结构的口令牌,并在电子模组电路中直接加入非接天线和芯片,实现产品功能非接个性化,结构简洁美观,利于高效制作生产。</description><language>chi ; eng</language><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ; CALCULATING ; COMPUTING ; COUNTING ; HANDLING RECORD CARRIERS ; PERFORMING OPERATIONS ; PHYSICS ; PRESENTATION OF DATA ; RECOGNITION OF DATA ; RECORD CARRIERS ; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR ; SHAPING OR JOINING OF PLASTICS ; TRANSPORTING ; WORKING OF PLASTICS ; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200612&DB=EPODOC&CC=CN&NR=210742998U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200612&DB=EPODOC&CC=CN&NR=210742998U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WAN TIANJUN</creatorcontrib><title>Non-contact non-assembly integrated password board</title><description>The utility model discloses a non-contact non-assembly integrated password board which comprises an electronic module and an injection molding glue layer wrapping the outer side of the electronic module, the electronic module and the glue layer are of an integrated structure, the electronic module comprises a non-contact antenna and a chip, and the chip is in lap joint with the non-contact antenna. According to the utility model, the password board with an integrated structure is obtained by injection molding of glue and the electronic module, and the non-contact antenna and the chip are directly added in the circuit of the electronic module, so that non-contact individuation of product functions is realized, the structure is simple and attractive, and efficient manufacturing and production are facilitated.
本实用新型公开了一种非接型非组装一体式口令牌,包括电子模组及包覆在所述电子模组外侧的注塑成型的胶水层,所述电子模组与胶水层为一体结构,所述电子模组包括非接天线和芯片,所述芯片与所述非接天线搭接。本实用新型采用胶水与电子模组注塑成型得到一体结构的口令牌,并在电子模组电路中直接加入非接天线和芯片,实现产品功能非接个性化,结构简洁美观,利于高效制作生产。</description><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</subject><subject>CALCULATING</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>HANDLING RECORD CARRIERS</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICS</subject><subject>PRESENTATION OF DATA</subject><subject>RECOGNITION OF DATA</subject><subject>RECORD CARRIERS</subject><subject>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</subject><subject>SHAPING OR JOINING OF PLASTICS</subject><subject>TRANSPORTING</subject><subject>WORKING OF PLASTICS</subject><subject>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDDyy8_TTc7PK0lMLlHIA7ITi4tTc5NyKhUy80pS04sSS1JTFAqAguX5RSkKSfmJRSk8DKxpiTnFqbxQmptByc01xNlDN7UgPz61uCAxOTUvtSTe2c_I0MDcxMjS0iI01JgoRQBIui0_</recordid><startdate>20200612</startdate><enddate>20200612</enddate><creator>WAN TIANJUN</creator><scope>EVB</scope></search><sort><creationdate>20200612</creationdate><title>Non-contact non-assembly integrated password board</title><author>WAN TIANJUN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN210742998UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2020</creationdate><topic>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</topic><topic>CALCULATING</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>HANDLING RECORD CARRIERS</topic><topic>PERFORMING OPERATIONS</topic><topic>PHYSICS</topic><topic>PRESENTATION OF DATA</topic><topic>RECOGNITION OF DATA</topic><topic>RECORD CARRIERS</topic><topic>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</topic><topic>SHAPING OR JOINING OF PLASTICS</topic><topic>TRANSPORTING</topic><topic>WORKING OF PLASTICS</topic><topic>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</topic><toplevel>online_resources</toplevel><creatorcontrib>WAN TIANJUN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WAN TIANJUN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Non-contact non-assembly integrated password board</title><date>2020-06-12</date><risdate>2020</risdate><abstract>The utility model discloses a non-contact non-assembly integrated password board which comprises an electronic module and an injection molding glue layer wrapping the outer side of the electronic module, the electronic module and the glue layer are of an integrated structure, the electronic module comprises a non-contact antenna and a chip, and the chip is in lap joint with the non-contact antenna. According to the utility model, the password board with an integrated structure is obtained by injection molding of glue and the electronic module, and the non-contact antenna and the chip are directly added in the circuit of the electronic module, so that non-contact individuation of product functions is realized, the structure is simple and attractive, and efficient manufacturing and production are facilitated.
本实用新型公开了一种非接型非组装一体式口令牌,包括电子模组及包覆在所述电子模组外侧的注塑成型的胶水层,所述电子模组与胶水层为一体结构,所述电子模组包括非接天线和芯片,所述芯片与所述非接天线搭接。本实用新型采用胶水与电子模组注塑成型得到一体结构的口令牌,并在电子模组电路中直接加入非接天线和芯片,实现产品功能非接个性化,结构简洁美观,利于高效制作生产。</abstract><oa>free_for_read</oa></addata></record> |
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language | chi ; eng |
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subjects | AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CALCULATING COMPUTING COUNTING HANDLING RECORD CARRIERS PERFORMING OPERATIONS PHYSICS PRESENTATION OF DATA RECOGNITION OF DATA RECORD CARRIERS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL |
title | Non-contact non-assembly integrated password board |
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