Integrated device
The utility model relates to the technical field of circuit board manufacturing. The utility model specifically discloses an integrated device. The device comprises a device body and a hot melting column, wherein the device body at least comprises two circuit boards which are arranged at intervals;...
Gespeichert in:
| Hauptverfasser: | , , , , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | SU ZHI WEN CHANG GAO QIANG HUANG YUQIN OU YANLING |
| description | The utility model relates to the technical field of circuit board manufacturing. The utility model specifically discloses an integrated device. The device comprises a device body and a hot melting column, wherein the device body at least comprises two circuit boards which are arranged at intervals; a connector is arranged between the two circuit boards; connector comprising an insulator, a plurality of conductors are arranged on one side of the insulator close to the circuit board; bonding pads corresponding to the conductors in number and position are arranged on one side surface, close to the insulator, of the circuit board; the electric conductor is abutted against the bonding pad to realize electric conduction; the two electric conductors on the two opposite side faces of the insulatorare electrically conducted through a conducting medium, a through hole is formed in the device body in the thickness direction in a penetrating mode, the hot melting column is installed in the through hole, the two ends of t |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN210692516UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN210692516UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN210692516UU3</originalsourceid><addsrcrecordid>eNrjZBD0zCtJTS9KLElNUUhJLctMTuVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfHOfkaGBmaWRqaGZqGhxkQpAgATlCBj</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Integrated device</title><source>esp@cenet</source><creator>SU ZHI ; WEN CHANG ; GAO QIANG ; HUANG YUQIN ; OU YANLING</creator><creatorcontrib>SU ZHI ; WEN CHANG ; GAO QIANG ; HUANG YUQIN ; OU YANLING</creatorcontrib><description>The utility model relates to the technical field of circuit board manufacturing. The utility model specifically discloses an integrated device. The device comprises a device body and a hot melting column, wherein the device body at least comprises two circuit boards which are arranged at intervals; a connector is arranged between the two circuit boards; connector comprising an insulator, a plurality of conductors are arranged on one side of the insulator close to the circuit board; bonding pads corresponding to the conductors in number and position are arranged on one side surface, close to the insulator, of the circuit board; the electric conductor is abutted against the bonding pad to realize electric conduction; the two electric conductors on the two opposite side faces of the insulatorare electrically conducted through a conducting medium, a through hole is formed in the device body in the thickness direction in a penetrating mode, the hot melting column is installed in the through hole, the two ends of t</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200605&DB=EPODOC&CC=CN&NR=210692516U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200605&DB=EPODOC&CC=CN&NR=210692516U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SU ZHI</creatorcontrib><creatorcontrib>WEN CHANG</creatorcontrib><creatorcontrib>GAO QIANG</creatorcontrib><creatorcontrib>HUANG YUQIN</creatorcontrib><creatorcontrib>OU YANLING</creatorcontrib><title>Integrated device</title><description>The utility model relates to the technical field of circuit board manufacturing. The utility model specifically discloses an integrated device. The device comprises a device body and a hot melting column, wherein the device body at least comprises two circuit boards which are arranged at intervals; a connector is arranged between the two circuit boards; connector comprising an insulator, a plurality of conductors are arranged on one side of the insulator close to the circuit board; bonding pads corresponding to the conductors in number and position are arranged on one side surface, close to the insulator, of the circuit board; the electric conductor is abutted against the bonding pad to realize electric conduction; the two electric conductors on the two opposite side faces of the insulatorare electrically conducted through a conducting medium, a through hole is formed in the device body in the thickness direction in a penetrating mode, the hot melting column is installed in the through hole, the two ends of t</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBD0zCtJTS9KLElNUUhJLctMTuVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfHOfkaGBmaWRqaGZqGhxkQpAgATlCBj</recordid><startdate>20200605</startdate><enddate>20200605</enddate><creator>SU ZHI</creator><creator>WEN CHANG</creator><creator>GAO QIANG</creator><creator>HUANG YUQIN</creator><creator>OU YANLING</creator><scope>EVB</scope></search><sort><creationdate>20200605</creationdate><title>Integrated device</title><author>SU ZHI ; WEN CHANG ; GAO QIANG ; HUANG YUQIN ; OU YANLING</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN210692516UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2020</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>SU ZHI</creatorcontrib><creatorcontrib>WEN CHANG</creatorcontrib><creatorcontrib>GAO QIANG</creatorcontrib><creatorcontrib>HUANG YUQIN</creatorcontrib><creatorcontrib>OU YANLING</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SU ZHI</au><au>WEN CHANG</au><au>GAO QIANG</au><au>HUANG YUQIN</au><au>OU YANLING</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Integrated device</title><date>2020-06-05</date><risdate>2020</risdate><abstract>The utility model relates to the technical field of circuit board manufacturing. The utility model specifically discloses an integrated device. The device comprises a device body and a hot melting column, wherein the device body at least comprises two circuit boards which are arranged at intervals; a connector is arranged between the two circuit boards; connector comprising an insulator, a plurality of conductors are arranged on one side of the insulator close to the circuit board; bonding pads corresponding to the conductors in number and position are arranged on one side surface, close to the insulator, of the circuit board; the electric conductor is abutted against the bonding pad to realize electric conduction; the two electric conductors on the two opposite side faces of the insulatorare electrically conducted through a conducting medium, a through hole is formed in the device body in the thickness direction in a penetrating mode, the hot melting column is installed in the through hole, the two ends of t</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN210692516UU |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Integrated device |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-20T17%3A39%3A06IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SU%20ZHI&rft.date=2020-06-05&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN210692516UU%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |