An active anode and electroplating apparatus for electroplating metal on substrate

The utility model relates to an active anode and an electroplating device for electroplating metal on a substrate. In one aspect, an active (consumable) anode includes a generally annular body and a projection for connecting the anode to a power source, where the projection extends outwardly from the generally annular body of the anode. In some embodiments, the generally annular body and protrusions are of the same composition, and in some embodiments, the anode is a one-piece anode that does not include any weld seam. Such a structure results in reduced voltage fluctuations during electroplating and improved control of electroplating uniformity. In some embodiments, the anode is a copper anode, a cobalt anode, or a nickel anode formed from a single anode stage metal processing. The anodeprovided may be used as a second anode disposed at the periphery in combination with a centrally located main anode in an electroplating apparatus. The anode provided is configured to condition electroplating at the edge of the substrate. 本实用新型涉及一种有源阳极和一种用于在衬底上电镀金属的电镀装置。在一个方面，有源(可消耗)阳极包括大致环形的主体和用于将阳极连接到电源的突起，其中突起从阳极的大致环形主的体向外延伸。大致环形的主体和突起的成分是相同的，并且在一些实施方案中，阳极是不包括任何焊缝的单件式阳极。这种结构导致电镀期间电压波动减小并且改善了对电镀均匀性的控制。在一些实施方案中，阳极是由单件阳极级金属加工而成的铜阳极、钴阳极或镍阳极。所提供的阳极可以在电镀装置中结合位于较中心的主阳极用作设置在外围的第二阳极。所提供的阳极被配置为调节在衬底边缘处的电镀。