Miniaturized HID ballast

Miniaturized HID ballast

The utility model discloses a miniaturized HID ballast which is characterized in that the miniaturized HID ballast comprises a housing and a driving module, and the driving module comprises a mainboard electric appliance element and a switch tube; wherein the shell comprises a bottom cover and a cov...

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Hauptverfasser: LAN JIANWEN, LIU HUOGEN, ZENG HANRONG, XIAO HUI, SONG YANGGUANG, CAO ZHENG, LUO RIHUI
Format: Patent
Sprache:chi ; eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC HEATING
ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator LAN JIANWEN
LIU HUOGEN
ZENG HANRONG
XIAO HUI
SONG YANGGUANG
CAO ZHENG
LUO RIHUI
description The utility model discloses a miniaturized HID ballast which is characterized in that the miniaturized HID ballast comprises a housing and a driving module, and the driving module comprises a mainboard electric appliance element and a switch tube; wherein the shell comprises a bottom cover and a cover body, the cover body is provided with an opening facing the bottom cover, and the bottom cover covers the opening and is fixed on the cover body; wherein a cavity is formed in the shell, and at least two partition plates which are arranged up and down at intervals are arranged in the cavity; a heat dissipation layer used for placing a switch tube is formed between the partition plate closest to the bottom of the cavity and the adjacent partition plate, a mainboard layer used for placing mainboard electrical apparatus elements is formed between the partition plate closest to the top of the cavity and the cavity, and the area of the partition plate closest to the bottom of the cavity is larger than that of the par
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN210183596UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN210183596UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN210183596UU3</originalsourceid><addsrcrecordid>eNrjZJDwzczLTCwpLcqsSk1R8PB0UUhKzMlJLC7hYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxzn5GhgaGFsamlmahocZEKQIAH84ixg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Miniaturized HID ballast</title><source>esp@cenet</source><creator>LAN JIANWEN ; LIU HUOGEN ; ZENG HANRONG ; XIAO HUI ; SONG YANGGUANG ; CAO ZHENG ; LUO RIHUI</creator><creatorcontrib>LAN JIANWEN ; LIU HUOGEN ; ZENG HANRONG ; XIAO HUI ; SONG YANGGUANG ; CAO ZHENG ; LUO RIHUI</creatorcontrib><description>The utility model discloses a miniaturized HID ballast which is characterized in that the miniaturized HID ballast comprises a housing and a driving module, and the driving module comprises a mainboard electric appliance element and a switch tube; wherein the shell comprises a bottom cover and a cover body, the cover body is provided with an opening facing the bottom cover, and the bottom cover covers the opening and is fixed on the cover body; wherein a cavity is formed in the shell, and at least two partition plates which are arranged up and down at intervals are arranged in the cavity; a heat dissipation layer used for placing a switch tube is formed between the partition plate closest to the bottom of the cavity and the adjacent partition plate, a mainboard layer used for placing mainboard electrical apparatus elements is formed between the partition plate closest to the top of the cavity and the cavity, and the area of the partition plate closest to the bottom of the cavity is larger than that of the par</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC HEATING ; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20200324&amp;DB=EPODOC&amp;CC=CN&amp;NR=210183596U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20200324&amp;DB=EPODOC&amp;CC=CN&amp;NR=210183596U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LAN JIANWEN</creatorcontrib><creatorcontrib>LIU HUOGEN</creatorcontrib><creatorcontrib>ZENG HANRONG</creatorcontrib><creatorcontrib>XIAO HUI</creatorcontrib><creatorcontrib>SONG YANGGUANG</creatorcontrib><creatorcontrib>CAO ZHENG</creatorcontrib><creatorcontrib>LUO RIHUI</creatorcontrib><title>Miniaturized HID ballast</title><description>The utility model discloses a miniaturized HID ballast which is characterized in that the miniaturized HID ballast comprises a housing and a driving module, and the driving module comprises a mainboard electric appliance element and a switch tube; wherein the shell comprises a bottom cover and a cover body, the cover body is provided with an opening facing the bottom cover, and the bottom cover covers the opening and is fixed on the cover body; wherein a cavity is formed in the shell, and at least two partition plates which are arranged up and down at intervals are arranged in the cavity; a heat dissipation layer used for placing a switch tube is formed between the partition plate closest to the bottom of the cavity and the adjacent partition plate, a mainboard layer used for placing mainboard electrical apparatus elements is formed between the partition plate closest to the top of the cavity and the cavity, and the area of the partition plate closest to the bottom of the cavity is larger than that of the par</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC HEATING</subject><subject>ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJDwzczLTCwpLcqsSk1R8PB0UUhKzMlJLC7hYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxzn5GhgaGFsamlmahocZEKQIAH84ixg</recordid><startdate>20200324</startdate><enddate>20200324</enddate><creator>LAN JIANWEN</creator><creator>LIU HUOGEN</creator><creator>ZENG HANRONG</creator><creator>XIAO HUI</creator><creator>SONG YANGGUANG</creator><creator>CAO ZHENG</creator><creator>LUO RIHUI</creator><scope>EVB</scope></search><sort><creationdate>20200324</creationdate><title>Miniaturized HID ballast</title><author>LAN JIANWEN ; LIU HUOGEN ; ZENG HANRONG ; XIAO HUI ; SONG YANGGUANG ; CAO ZHENG ; LUO RIHUI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN210183596UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2020</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC HEATING</topic><topic>ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>LAN JIANWEN</creatorcontrib><creatorcontrib>LIU HUOGEN</creatorcontrib><creatorcontrib>ZENG HANRONG</creatorcontrib><creatorcontrib>XIAO HUI</creatorcontrib><creatorcontrib>SONG YANGGUANG</creatorcontrib><creatorcontrib>CAO ZHENG</creatorcontrib><creatorcontrib>LUO RIHUI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LAN JIANWEN</au><au>LIU HUOGEN</au><au>ZENG HANRONG</au><au>XIAO HUI</au><au>SONG YANGGUANG</au><au>CAO ZHENG</au><au>LUO RIHUI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Miniaturized HID ballast</title><date>2020-03-24</date><risdate>2020</risdate><abstract>The utility model discloses a miniaturized HID ballast which is characterized in that the miniaturized HID ballast comprises a housing and a driving module, and the driving module comprises a mainboard electric appliance element and a switch tube; wherein the shell comprises a bottom cover and a cover body, the cover body is provided with an opening facing the bottom cover, and the bottom cover covers the opening and is fixed on the cover body; wherein a cavity is formed in the shell, and at least two partition plates which are arranged up and down at intervals are arranged in the cavity; a heat dissipation layer used for placing a switch tube is formed between the partition plate closest to the bottom of the cavity and the adjacent partition plate, a mainboard layer used for placing mainboard electrical apparatus elements is formed between the partition plate closest to the top of the cavity and the cavity, and the area of the partition plate closest to the bottom of the cavity is larger than that of the par</abstract><oa>free_for_read</oa></addata></record>
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC HEATING
ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title Miniaturized HID ballast
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