Solder thief pad for preventing multi-pin DIP element from over-wave soldering and tin connection
The utility model discloses a solder thief pad for preventing a multi-pin DIP element from over-wave soldering and tin connection, a solder thief pad is added to a bottom wiring layer of a PCB, and the solder thief pad is arranged at one side of a PCB pad and is opposite to a wave soldering plate pa...
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| creator | XU JIAN YIN QIANG YUAN HEXIU MA XIUBI |
| description | The utility model discloses a solder thief pad for preventing a multi-pin DIP element from over-wave soldering and tin connection, a solder thief pad is added to a bottom wiring layer of a PCB, and the solder thief pad is arranged at one side of a PCB pad and is opposite to a wave soldering plate passing direction. The distance between the solder thief pad and the edge of the PCB pad is 0.8 mm, the width of the solder thief pad along the wave soldering direction is 4mm, and the length of the solder thief pad is equal to the width of the PAD. According to the utility model, through the design of adding the solder thief pad on the BOT layer of the PCB, the problems of tin connection and short circuit behind the furnace are solved, and the problems of tin connection and short circuit caused by the fact that the PAD interval of a multi-pin DIP element is small, the manufacturing process capability of a PCB manufacturer is limited and a white oil block cannot be manufactured are solved.
本实用新型公开了一种防止多引脚DIP元件过波峰焊连锡的 |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN209994630UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN209994630UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN209994630UU3</originalsourceid><addsrcrecordid>eNqNjLEKwjAURbs4iPoPD_dCsSJ0roouImjnEpKbGkjfC2msv28VP8DpDPfcM8_UTbxBpPRwsBSUISuRQsQITo476p8-uTw4pv35SvDop4FslJ5kRMxfagQN38hHV2xo-pEWZujkhJfZzCo_YPXjIlsfD_f6lCNIiyEoDUZq68umqKpquyuLpin_kt5MLT4y</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Solder thief pad for preventing multi-pin DIP element from over-wave soldering and tin connection</title><source>esp@cenet</source><creator>XU JIAN ; YIN QIANG ; YUAN HEXIU ; MA XIUBI</creator><creatorcontrib>XU JIAN ; YIN QIANG ; YUAN HEXIU ; MA XIUBI</creatorcontrib><description>The utility model discloses a solder thief pad for preventing a multi-pin DIP element from over-wave soldering and tin connection, a solder thief pad is added to a bottom wiring layer of a PCB, and the solder thief pad is arranged at one side of a PCB pad and is opposite to a wave soldering plate passing direction. The distance between the solder thief pad and the edge of the PCB pad is 0.8 mm, the width of the solder thief pad along the wave soldering direction is 4mm, and the length of the solder thief pad is equal to the width of the PAD. According to the utility model, through the design of adding the solder thief pad on the BOT layer of the PCB, the problems of tin connection and short circuit behind the furnace are solved, and the problems of tin connection and short circuit caused by the fact that the PAD interval of a multi-pin DIP element is small, the manufacturing process capability of a PCB manufacturer is limited and a white oil block cannot be manufactured are solved.
本实用新型公开了一种防止多引脚DIP元件过波峰焊连锡的</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200124&DB=EPODOC&CC=CN&NR=209994630U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200124&DB=EPODOC&CC=CN&NR=209994630U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>XU JIAN</creatorcontrib><creatorcontrib>YIN QIANG</creatorcontrib><creatorcontrib>YUAN HEXIU</creatorcontrib><creatorcontrib>MA XIUBI</creatorcontrib><title>Solder thief pad for preventing multi-pin DIP element from over-wave soldering and tin connection</title><description>The utility model discloses a solder thief pad for preventing a multi-pin DIP element from over-wave soldering and tin connection, a solder thief pad is added to a bottom wiring layer of a PCB, and the solder thief pad is arranged at one side of a PCB pad and is opposite to a wave soldering plate passing direction. The distance between the solder thief pad and the edge of the PCB pad is 0.8 mm, the width of the solder thief pad along the wave soldering direction is 4mm, and the length of the solder thief pad is equal to the width of the PAD. According to the utility model, through the design of adding the solder thief pad on the BOT layer of the PCB, the problems of tin connection and short circuit behind the furnace are solved, and the problems of tin connection and short circuit caused by the fact that the PAD interval of a multi-pin DIP element is small, the manufacturing process capability of a PCB manufacturer is limited and a white oil block cannot be manufactured are solved.
本实用新型公开了一种防止多引脚DIP元件过波峰焊连锡的</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjLEKwjAURbs4iPoPD_dCsSJ0roouImjnEpKbGkjfC2msv28VP8DpDPfcM8_UTbxBpPRwsBSUISuRQsQITo476p8-uTw4pv35SvDop4FslJ5kRMxfagQN38hHV2xo-pEWZujkhJfZzCo_YPXjIlsfD_f6lCNIiyEoDUZq68umqKpquyuLpin_kt5MLT4y</recordid><startdate>20200124</startdate><enddate>20200124</enddate><creator>XU JIAN</creator><creator>YIN QIANG</creator><creator>YUAN HEXIU</creator><creator>MA XIUBI</creator><scope>EVB</scope></search><sort><creationdate>20200124</creationdate><title>Solder thief pad for preventing multi-pin DIP element from over-wave soldering and tin connection</title><author>XU JIAN ; YIN QIANG ; YUAN HEXIU ; MA XIUBI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN209994630UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2020</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>XU JIAN</creatorcontrib><creatorcontrib>YIN QIANG</creatorcontrib><creatorcontrib>YUAN HEXIU</creatorcontrib><creatorcontrib>MA XIUBI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>XU JIAN</au><au>YIN QIANG</au><au>YUAN HEXIU</au><au>MA XIUBI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Solder thief pad for preventing multi-pin DIP element from over-wave soldering and tin connection</title><date>2020-01-24</date><risdate>2020</risdate><abstract>The utility model discloses a solder thief pad for preventing a multi-pin DIP element from over-wave soldering and tin connection, a solder thief pad is added to a bottom wiring layer of a PCB, and the solder thief pad is arranged at one side of a PCB pad and is opposite to a wave soldering plate passing direction. The distance between the solder thief pad and the edge of the PCB pad is 0.8 mm, the width of the solder thief pad along the wave soldering direction is 4mm, and the length of the solder thief pad is equal to the width of the PAD. According to the utility model, through the design of adding the solder thief pad on the BOT layer of the PCB, the problems of tin connection and short circuit behind the furnace are solved, and the problems of tin connection and short circuit caused by the fact that the PAD interval of a multi-pin DIP element is small, the manufacturing process capability of a PCB manufacturer is limited and a white oil block cannot be manufactured are solved.
本实用新型公开了一种防止多引脚DIP元件过波峰焊连锡的</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Solder thief pad for preventing multi-pin DIP element from over-wave soldering and tin connection |
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