Liquid metal printer and chip mounting mechanism thereof
The utility model discloses a liquid metal printer, and a chip mounting mechanism and a chip mounting mechanism thereof. The chip mounting mechanism comprises a tubular chip mounting gun linked with afirst moving mechanism, and a working surface used for adsorbing a chip mounting element through a b...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model discloses a liquid metal printer, and a chip mounting mechanism and a chip mounting mechanism thereof. The chip mounting mechanism comprises a tubular chip mounting gun linked with afirst moving mechanism, and a working surface used for adsorbing a chip mounting element through a bottom suction nozzle and moving the chip mounting element to different heights through the first moving mechanism. The element box is linked with the second movable mechanism, one or more patch elements are placed in the element box, and the element box is used for moving the patch elements in theelement box to the position under a suction nozzle of the tubular patch gun through the second movable mechanism; and the dispensing head is linked with the third movable mechanism, a glue outlet nozzle of the dispensing head faces upwards, and the dispensing head is used for moving to the position under the chip mounting element through the third movable mechanism and dispensing glue on the bottom surface of the chip moun |
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