Packaging structure

The utility model discloses a packaging structure, which solves the problem that a lead is broken due to the fact that a packaging body is subjected to internal stress change in the prior art, and simultaneously reduces the influence of the stress problem inside the whole packaging body on the funct...

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Hauptverfasser:	LIU ZHAOLIN, XING GUANGJUN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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creator	LIU ZHAOLIN XING GUANGJUN
description	The utility model discloses a packaging structure, which solves the problem that a lead is broken due to the fact that a packaging body is subjected to internal stress change in the prior art, and simultaneously reduces the influence of the stress problem inside the whole packaging body on the functions of a chip, and adopts the scheme that the packaging structure comprises a substrate or a frame,mounting a chip on the surface of the substrate or the frame, wherein the chip is connected with a pin arranged on the substrate or the frame through a lead; the first packaging layer covers the surface and the peripheral side of the chip and covers the connection point of the chip and the wire; and the second packaging layer covers a part of the outer side of the first packaging layer and the surface of the substrate or the frame, and the second packaging layer is provided with a cavity structure for exposing a local area of the chip. 本实用新型公开了一种封装结构，它解决了现有技术中封装体受到内部应力变化而导致导线断裂的问题，同时降低整个封装体内部由应力问题对芯片功能影响，其方案如下：一种封装结构
format	Patent
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subjects	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
title	Packaging structure
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