The invention discloses a server chip liquid cooling heat dissipation system
The utility model discloses a liquid cooling heat dissipation system for a server chip, which comprises a cooling circulation device, a liquid cooling pipeline and a server chip, and is characterizedin that the cooling circulation device is connected with the server chip through the liquid cooling p...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model discloses a liquid cooling heat dissipation system for a server chip, which comprises a cooling circulation device, a liquid cooling pipeline and a server chip, and is characterizedin that the cooling circulation device is connected with the server chip through the liquid cooling pipeline; The cooling circulation device comprises a liquid pump; the liquid pump is connected witha liquid cooling pipeline; Various heating chips of an existing server are many, air cooling heat dissipation is independently adopted, the requirement for the heating chips at all positions cannot bemet, and one or more heating chips are subjected to heat dissipation through one liquid cooling pipeline. The liquid pump drives the cooling liquid to flow, consumed energy is not higher than that ofthe fan, and the energy-saving effect is achieved. The cooling circulation device is connected with a plurality of liquid cooling pipelines, and each liquid cooling pipeline is connected with a liquid pump. The working strength |
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