Mix printed circuit board
The application discloses mix printed circuit board, it includes low frequency base plate, high frequency base plate to and monolithic microwave integrated circuit crystalline grain, MMIC crystallinegrain invert in on the high frequency base plate, the low frequency base plate includes first low fre...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The application discloses mix printed circuit board, it includes low frequency base plate, high frequency base plate to and monolithic microwave integrated circuit crystalline grain, MMIC crystallinegrain invert in on the high frequency base plate, the low frequency base plate includes first low frequency base plate and second low frequency base plate, the high frequency base plate includes the first high -frequency base plate and second high frequency base plate, the first high -frequency base plate and second high frequency base plate separate each other and the lamination in a surface of second low frequency base plate, first low frequency base plate lamination in second low frequency base plate the surface just is located between the first high -frequency base plate and the second high frequency base plate, the first high -frequency base plate, second high frequency base plate and the monolithic microwave integrated circuit crystalline grain of flip -chip, and first low frequencybase plate defines a cavit |
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