Novel semiconductor laser packaging structure and heat -sink device

An embodiment of the utility model discloses a novel semiconductor laser packaging structure and heat -sink device, packaging structure includes: have a plurality of luminous points laser chip, at least one is heat sink, wherein, the laser chip bonded in on at least one is heat sink, the surface that at least one is heat sink is provided with hot compensation structure, hot compensation structureis used for controlling the heat dissipation of the luminous point of laser chip both ends edge. Based on the utility model provides a packaging structure and heat -sink device can be effectively carry out the heat compensation to the luminous point at laser chip's edge for the junction temperature and the output wavelength of each luminous point are unanimous basically, thereby realize laser chip's narrow spectral output. 本实用新型实施例公开种新型的半导体激光器封装结构及散热器件，所述封装结构包括：具有多个发光点的激光芯片、至少个热沉；其中，激光芯片键合于所述至少个热沉上；至少个热沉的表面设置有热补偿结构，所述热补偿结构用于对激光芯片两端边缘处的发光点的散热进行控制。基于本实用新型提供的封装结构及散热器件，能够有效地对激光芯片的边缘的发光点进行热量补偿，使得各发光点的结温及输出波长基本致，从而实现激光芯片的窄光