Novel hot switch chip and have its heat exchanger

The utility model provides a heat exchanger technical field's novel hot switch chip and have its heat exchanger, includes through stamping forming's plane sheet metal and sets up at plane sheet metalturn -ups all around, the turn -ups for being the end to end's of a constant angle deg...

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description The utility model provides a heat exchanger technical field's novel hot switch chip and have its heat exchanger, includes through stamping forming's plane sheet metal and sets up at plane sheet metalturn -ups all around, the turn -ups for being the end to end's of a constant angle degree wave -shaped plate material structure with the plane sheet metal. The utility model discloses well turn -ups adopts the wave structure, has improved turn down rims intensity for the transportation, the turn -ups is difficult to because rebound phenomenon appears in the release of stress among the soldering process and after the shaping, and the turn down rims location degree of difficulty promotes for the reduction of plane panel, bonding area relatively from top to bottom, has improved welding quality. 种换热器技术领域的新型热交换芯片及具有其的换热器,包括通过冲压成型的平面薄板及设置在平面薄板四周的翻边,所述的翻边为与平面薄板呈定角度的首尾相连的波浪形板材结构。本实用新型中翻边采用波浪形结构,提高了翻边的强度,使得运输、钎焊过程中和成型后翻边不容易由于应力释放出现回弹现象;且上下翻边的定位难度相对于平面板材降低、焊接面积相对提升,提高了焊接质量。
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The utility model discloses well turn -ups adopts the wave structure, has improved turn down rims intensity for the transportation, the turn -ups is difficult to because rebound phenomenon appears in the release of stress among the soldering process and after the shaping, and the turn down rims location degree of difficulty promotes for the reduction of plane panel, bonding area relatively from top to bottom, has improved welding quality. 种换热器技术领域的新型热交换芯片及具有其的换热器,包括通过冲压成型的平面薄板及设置在平面薄板四周的翻边,所述的翻边为与平面薄板呈定角度的首尾相连的波浪形板材结构。本实用新型中翻边采用波浪形结构,提高了翻边的强度,使得运输、钎焊过程中和成型后翻边不容易由于应力释放出现回弹现象;且上下翻边的定位难度相对于平面板材降低、焊接面积相对提升,提高了焊接质量。</description><language>chi ; eng</language><subject>BLASTING ; DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ; HEAT EXCHANGE IN GENERAL ; HEATING ; LIGHTING ; MECHANICAL ENGINEERING ; WEAPONS</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20181002&amp;DB=EPODOC&amp;CC=CN&amp;NR=207936832U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20181002&amp;DB=EPODOC&amp;CC=CN&amp;NR=207936832U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YIN RENHAO</creatorcontrib><title>Novel hot switch chip and have its heat exchanger</title><description>The utility model provides a heat exchanger technical field's novel hot switch chip and have its heat exchanger, includes through stamping forming's plane sheet metal and sets up at plane sheet metalturn -ups all around, the turn -ups for being the end to end's of a constant angle degree wave -shaped plate material structure with the plane sheet metal. 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The utility model discloses well turn -ups adopts the wave structure, has improved turn down rims intensity for the transportation, the turn -ups is difficult to because rebound phenomenon appears in the release of stress among the soldering process and after the shaping, and the turn down rims location degree of difficulty promotes for the reduction of plane panel, bonding area relatively from top to bottom, has improved welding quality. 种换热器技术领域的新型热交换芯片及具有其的换热器,包括通过冲压成型的平面薄板及设置在平面薄板四周的翻边,所述的翻边为与平面薄板呈定角度的首尾相连的波浪形板材结构。本实用新型中翻边采用波浪形结构,提高了翻边的强度,使得运输、钎焊过程中和成型后翻边不容易由于应力释放出现回弹现象;且上下翻边的定位难度相对于平面板材降低、焊接面积相对提升,提高了焊接质量。</abstract><oa>free_for_read</oa></addata></record>
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subjects BLASTING
DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION
HEAT EXCHANGE IN GENERAL
HEATING
LIGHTING
MECHANICAL ENGINEERING
WEAPONS
title Novel hot switch chip and have its heat exchanger
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