Remove and glue reaction chamber and wafer clean -up equipment
The utility model discloses a remove and glue reaction chamber and wafer clean -up equipment belongs to semiconductor device manufacture technical field, is applicable to the photoresistance of cleaing away on the wafer, removes gluey reaction chamber and includes: multiple wafer handles the station...
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| creator | TANG YAMIN |
| description | The utility model discloses a remove and glue reaction chamber and wafer clean -up equipment belongs to semiconductor device manufacture technical field, is applicable to the photoresistance of cleaing away on the wafer, removes gluey reaction chamber and includes: multiple wafer handles the station, and pending wafer is placed station department is handled to the wafer, a plurality of thimble device set up respectively in a plurality of on the wafer processing station, every thimble device includes a needle base seat and a plurality of thimble, every the thimble include fixed part and set upperpendicularly in the last top needle body of fixed part, fixed part is fixed in in the needle base seat of top, in every fixed part dorsad set up a pressure sensor in top needle body's the one side.Above -mentioned technical scheme's beneficial effect is: bottom removing the thimble in gluing the reaction chamber sets up pressure sensor, acquires the data of calculating the wafer position, makes to possess the device of |
| format | Patent |
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| language | chi ; eng |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Remove and glue reaction chamber and wafer clean -up equipment |
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