Laser complex machining device that glass miniflow was said
The utility model relates to a laser complex machining device that glass miniflow was said, processingequipment mainly includes: cutting head battery of lens, side shaft air inlet, controllable movingplatform, laser wash beam shaping system, XY scanning galvanometer, focusing mirror, the back of the...
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| creator | HU WEI CAO ZHOUQUAN LIU SHUAI WENG QING XIE XIAOZHU WEI XIN |
| description | The utility model relates to a laser complex machining device that glass miniflow was said, processingequipment mainly includes: cutting head battery of lens, side shaft air inlet, controllable movingplatform, laser wash beam shaping system, XY scanning galvanometer, focusing mirror, the back of the body preliminary exemplar, the laser cleaning fixture of taking shape at quarter. A whole set of processingequipment comprises laser back of the body quarter and the two major modules of laser washing, can realize the back of the body that the glass miniflow was said and carve shapingly and the abluent combined machining of laser. The utility model discloses the miniflow that device institute processed out says that the structure size is even, and roughness is good, and the runner inner wall does not have a chemical residual of being harmful, the utility model discloses the device is convenient for integratedly, easy operation, and convenient and practical, it is low to have higher processing speed and processing |
| format | Patent |
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A whole set of processingequipment comprises laser back of the body quarter and the two major modules of laser washing, can realize the back of the body that the glass miniflow was said and carve shapingly and the abluent combined machining of laser. The utility model discloses the miniflow that device institute processed out says that the structure size is even, and roughness is good, and the runner inner wall does not have a chemical residual of being harmful, the utility model discloses the device is convenient for integratedly, easy operation, and convenient and practical, it is low to have higher processing speed and processing</description><language>chi ; eng</language><subject>CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180209&DB=EPODOC&CC=CN&NR=206981997U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76419</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180209&DB=EPODOC&CC=CN&NR=206981997U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HU WEI</creatorcontrib><creatorcontrib>CAO ZHOUQUAN</creatorcontrib><creatorcontrib>LIU SHUAI</creatorcontrib><creatorcontrib>WENG QING</creatorcontrib><creatorcontrib>XIE XIAOZHU</creatorcontrib><creatorcontrib>WEI XIN</creatorcontrib><title>Laser complex machining device that glass miniflow was said</title><description>The utility model relates to a laser complex machining device that glass miniflow was said, processingequipment mainly includes: cutting head battery of lens, side shaft air inlet, controllable movingplatform, laser wash beam shaping system, XY scanning galvanometer, focusing mirror, the back of the body preliminary exemplar, the laser cleaning fixture of taking shape at quarter. A whole set of processingequipment comprises laser back of the body quarter and the two major modules of laser washing, can realize the back of the body that the glass miniflow was said and carve shapingly and the abluent combined machining of laser. The utility model discloses the miniflow that device institute processed out says that the structure size is even, and roughness is good, and the runner inner wall does not have a chemical residual of being harmful, the utility model discloses the device is convenient for integratedly, easy operation, and convenient and practical, it is low to have higher processing speed and processing</description><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLD2SSxOLVJIzs8tyEmtUMhNTM7IzMvMS1dISS3LTE5VKMlILFFIz0ksLlbIBUqk5eSXK5QnFisUJ2am8DCwpiXmFKfyQmluBiU31xBnD93Ugvz41OKCxOTUvNSSeGc_IwMzSwtDS0vz0FBjohQBAAwEMEU</recordid><startdate>20180209</startdate><enddate>20180209</enddate><creator>HU WEI</creator><creator>CAO ZHOUQUAN</creator><creator>LIU SHUAI</creator><creator>WENG QING</creator><creator>XIE XIAOZHU</creator><creator>WEI XIN</creator><scope>EVB</scope></search><sort><creationdate>20180209</creationdate><title>Laser complex machining device that glass miniflow was said</title><author>HU WEI ; CAO ZHOUQUAN ; LIU SHUAI ; WENG QING ; XIE XIAOZHU ; WEI XIN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN206981997UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2018</creationdate><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>HU WEI</creatorcontrib><creatorcontrib>CAO ZHOUQUAN</creatorcontrib><creatorcontrib>LIU SHUAI</creatorcontrib><creatorcontrib>WENG QING</creatorcontrib><creatorcontrib>XIE XIAOZHU</creatorcontrib><creatorcontrib>WEI XIN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HU WEI</au><au>CAO ZHOUQUAN</au><au>LIU SHUAI</au><au>WENG QING</au><au>XIE XIAOZHU</au><au>WEI XIN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Laser complex machining device that glass miniflow was said</title><date>2018-02-09</date><risdate>2018</risdate><abstract>The utility model relates to a laser complex machining device that glass miniflow was said, processingequipment mainly includes: cutting head battery of lens, side shaft air inlet, controllable movingplatform, laser wash beam shaping system, XY scanning galvanometer, focusing mirror, the back of the body preliminary exemplar, the laser cleaning fixture of taking shape at quarter. A whole set of processingequipment comprises laser back of the body quarter and the two major modules of laser washing, can realize the back of the body that the glass miniflow was said and carve shapingly and the abluent combined machining of laser. The utility model discloses the miniflow that device institute processed out says that the structure size is even, and roughness is good, and the runner inner wall does not have a chemical residual of being harmful, the utility model discloses the device is convenient for integratedly, easy operation, and convenient and practical, it is low to have higher processing speed and processing</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | Laser complex machining device that glass miniflow was said |
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