Encapsulation of LED module BGA fixed knot construct

Encapsulation of LED module BGA fixed knot construct

The utility model provides an encapsulation of LED module BGA fixed knot construct, LED module, PCB board and BGA paste dress welding jig, the LED module is the light source device of BGA encapsulation, the solder joint of bump array is located the BGA package substrate back, the LSI chip is located...

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Hauptverfasser: LIN CHUNREN, TAN LINGZHEN
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Sprache:chi ; eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator LIN CHUNREN
TAN LINGZHEN
description The utility model provides an encapsulation of LED module BGA fixed knot construct, LED module, PCB board and BGA paste dress welding jig, the LED module is the light source device of BGA encapsulation, the solder joint of bump array is located the BGA package substrate back, the LSI chip is located BGA package substrate openly, the resin material who is equipped with in the LSI chip with mould pressing or filling encapsulates fixed LED luminotron and support circuit, electric connection between LSI chip and the bump array, PCB board department is equipped with BGA light source pad, BGA pastes dress welding jig and is a locating plate, be equipped with more than one light source fixed orifices on the locating plate, when carrying out dress or welding to the LED module, the locating plate is with on can the dismantlement mode being fixed in the PCB board, and the LED module sets position and welding position with the light source fixed orifices at PCB board facing, retakes down the locating plate as LED module
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Encapsulation of LED module BGA fixed knot construct
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