Chip bonding machine chip bonding machine constructs

The utility model discloses a chip bonding machine chip bonding machine constructs, putting including horizontal table and chip and getting the mechanism, the chip is put and is got the mechanism and include vacuum pump, suction nozzle and motion frame, be fixed with the tubular metal resonator on t...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	WANG ANYUN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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