Chip bonding machine chip bonding machine constructs

Chip bonding machine chip bonding machine constructs

The utility model discloses a chip bonding machine chip bonding machine constructs, putting including horizontal table and chip and getting the mechanism, the chip is put and is got the mechanism and include vacuum pump, suction nozzle and motion frame, be fixed with the tubular metal resonator on t...

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Sprache:chi ; eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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description The utility model discloses a chip bonding machine chip bonding machine constructs, putting including horizontal table and chip and getting the mechanism, the chip is put and is got the mechanism and include vacuum pump, suction nozzle and motion frame, be fixed with the tubular metal resonator on the motion frame, tubular metal resonator one end links to each other with the vacuum pump, and the other end links to each other with the suction nozzle, the side that the workstation is close to the motion frame is fixed with the fixed station, be fixed with cross sliding table on the fixed station, cross sliding table links to each other with the motion frame, and the motion is put up and be fixed with the photoreceptor on the side of fixed station, just be equipped with the laser emitter to the photoreceptor on the fixed station, be fixed with the count siren on the fixed station, the photoreceptor is connected with count siren electricity, and it has accurately the advantage of controlling suction nozzle life,
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Chip bonding machine chip bonding machine constructs
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