A packaging structure and intelligent power module for intelligent power module
The utility model provides a packaging structure for intelligent power module, include: base plate, frame, injecting glue layer, electrode and muscle spine, the injecting glue level is on the base plate, the frame will base plate and injecting glue layer are all including the cladding, the electrode...
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| creator | ZENG QIULIAN YANG SHENGSONG SHI CAIYUN REN SIHAN |
| description | The utility model provides a packaging structure for intelligent power module, include: base plate, frame, injecting glue layer, electrode and muscle spine, the injecting glue level is on the base plate, the frame will base plate and injecting glue layer are all including the cladding, the electrode is located on the frame, the last reason of electrode and going up along the parallel and level of frame, the muscle spine is located the frame upper surface and is close to electrode inclusive AND electrode and meets. According to the utility model discloses a height that is used for the packaging structure of intelligent power module, increase the frame height to with the high parallel and level of electrode, can increase the injecting glue layer to improve the space utilization and the packaging product yield of intelligent power module, set up the muscle spine simultaneously, can guarantee the electrical insulation characteristic of intelligent power module.
本实用新型提供种用于智能功率模块的封装结构，包括：基板、框架、注胶层、电极和筋脊，所述注胶层位于基板上， |
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本实用新型提供种用于智能功率模块的封装结构，包括：基板、框架、注胶层、电极和筋脊，所述注胶层位于基板上，</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20171027&DB=EPODOC&CC=CN&NR=206595250U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20171027&DB=EPODOC&CC=CN&NR=206595250U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ZENG QIULIAN</creatorcontrib><creatorcontrib>YANG SHENGSONG</creatorcontrib><creatorcontrib>SHI CAIYUN</creatorcontrib><creatorcontrib>REN SIHAN</creatorcontrib><title>A packaging structure and intelligent power module for intelligent power module</title><description>The utility model provides a packaging structure for intelligent power module, include: base plate, frame, injecting glue layer, electrode and muscle spine, the injecting glue level is on the base plate, the frame will base plate and injecting glue layer are all including the cladding, the electrode is located on the frame, the last reason of electrode and going up along the parallel and level of frame, the muscle spine is located the frame upper surface and is close to electrode inclusive AND electrode and meets. According to the utility model discloses a height that is used for the packaging structure of intelligent power module, increase the frame height to with the high parallel and level of electrode, can increase the injecting glue layer to improve the space utilization and the packaging product yield of intelligent power module, set up the muscle spine simultaneously, can guarantee the electrical insulation characteristic of intelligent power module.
本实用新型提供种用于智能功率模块的封装结构，包括：基板、框架、注胶层、电极和筋脊，所述注胶层位于基板上，</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPB3VChITM5OTM_MS1coLikqTS4pLUpVSMxLUcjMK0nNyclMT80rUSjIL08tUsjNTynNSVVIyy_CKcnDwJqWmFOcyguluRmU3FxDnD10Uwvy41OLgXal5qWWxDv7GRmYmVqaGpkahIYaE6UIAAFbOEM</recordid><startdate>20171027</startdate><enddate>20171027</enddate><creator>ZENG QIULIAN</creator><creator>YANG SHENGSONG</creator><creator>SHI CAIYUN</creator><creator>REN SIHAN</creator><scope>EVB</scope></search><sort><creationdate>20171027</creationdate><title>A packaging structure and intelligent power module for intelligent power module</title><author>ZENG QIULIAN ; YANG SHENGSONG ; SHI CAIYUN ; REN SIHAN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN206595250UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2017</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>ZENG QIULIAN</creatorcontrib><creatorcontrib>YANG SHENGSONG</creatorcontrib><creatorcontrib>SHI CAIYUN</creatorcontrib><creatorcontrib>REN SIHAN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ZENG QIULIAN</au><au>YANG SHENGSONG</au><au>SHI CAIYUN</au><au>REN SIHAN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>A packaging structure and intelligent power module for intelligent power module</title><date>2017-10-27</date><risdate>2017</risdate><abstract>The utility model provides a packaging structure for intelligent power module, include: base plate, frame, injecting glue layer, electrode and muscle spine, the injecting glue level is on the base plate, the frame will base plate and injecting glue layer are all including the cladding, the electrode is located on the frame, the last reason of electrode and going up along the parallel and level of frame, the muscle spine is located the frame upper surface and is close to electrode inclusive AND electrode and meets. According to the utility model discloses a height that is used for the packaging structure of intelligent power module, increase the frame height to with the high parallel and level of electrode, can increase the injecting glue layer to improve the space utilization and the packaging product yield of intelligent power module, set up the muscle spine simultaneously, can guarantee the electrical insulation characteristic of intelligent power module.
本实用新型提供种用于智能功率模块的封装结构，包括：基板、框架、注胶层、电极和筋脊，所述注胶层位于基板上，</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | A packaging structure and intelligent power module for intelligent power module |
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