Encapsulation shell based on LCP base plate

Encapsulation shell based on LCP base plate

The utility model relates to an encapsulation shell based on LCP base plate. The encapsulation shell includes that the metal encloses the frame, sets up and encloses LCP base plate composite bed that the multilayer LCP base plate lamination with anylayer interconnection the frame under formed and th...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: LYU JIPING, CHEN YIJUN, HU LIULIN, WANG DONG, QIN CHAO, BIAN LIFEI, TONG WEI, LU CHAOBAO, TANG ZHONGJUN, JIA QI
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator LYU JIPING
CHEN YIJUN
HU LIULIN
WANG DONG
QIN CHAO
BIAN LIFEI
TONG WEI
LU CHAOBAO
TANG ZHONGJUN
JIA QI
description The utility model relates to an encapsulation shell based on LCP base plate. The encapsulation shell includes that the metal encloses the frame, sets up and encloses LCP base plate composite bed that the multilayer LCP base plate lamination with anylayer interconnection the frame under formed and the metal attachment on the metal encloses the frame approximately in the metal, the metal encloses frame and the airtight connection of LCP base plate composite bed, metal attachment and metal enclose the airtight connection of frame, LCP base plate composite bed encloses the frame weld layer including die bonding layer, gold wire bonded layer and components and parts and the metal that connects gradually, and the metal encloses the frame weld layer and is provided with the through -hole, realizes that good ground connection and space keep apart, each layer of LCP base plate composite bed is provided with electroplates solid hole, realizes anylayer electrical connection. The utility model discloses a shell has gas t
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN206259334UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN206259334UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN206259334UU3</originalsourceid><addsrcrecordid>eNrjZNB2zUtOLCguzUksyczPUyjOSM3JUUhKLE5NUQByfZwDwByFAqB8Kg8Da1piTnEqL5TmZlBycw1x9tBNLciPTy0uSExOzUstiXf2MzIwMzK1NDY2CQ01JkoRAHVvKYQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Encapsulation shell based on LCP base plate</title><source>esp@cenet</source><creator>LYU JIPING ; CHEN YIJUN ; HU LIULIN ; WANG DONG ; QIN CHAO ; BIAN LIFEI ; TONG WEI ; LU CHAOBAO ; TANG ZHONGJUN ; JIA QI</creator><creatorcontrib>LYU JIPING ; CHEN YIJUN ; HU LIULIN ; WANG DONG ; QIN CHAO ; BIAN LIFEI ; TONG WEI ; LU CHAOBAO ; TANG ZHONGJUN ; JIA QI</creatorcontrib><description>The utility model relates to an encapsulation shell based on LCP base plate. The encapsulation shell includes that the metal encloses the frame, sets up and encloses LCP base plate composite bed that the multilayer LCP base plate lamination with anylayer interconnection the frame under formed and the metal attachment on the metal encloses the frame approximately in the metal, the metal encloses frame and the airtight connection of LCP base plate composite bed, metal attachment and metal enclose the airtight connection of frame, LCP base plate composite bed encloses the frame weld layer including die bonding layer, gold wire bonded layer and components and parts and the metal that connects gradually, and the metal encloses the frame weld layer and is provided with the through -hole, realizes that good ground connection and space keep apart, each layer of LCP base plate composite bed is provided with electroplates solid hole, realizes anylayer electrical connection. The utility model discloses a shell has gas t</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20170616&amp;DB=EPODOC&amp;CC=CN&amp;NR=206259334U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20170616&amp;DB=EPODOC&amp;CC=CN&amp;NR=206259334U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LYU JIPING</creatorcontrib><creatorcontrib>CHEN YIJUN</creatorcontrib><creatorcontrib>HU LIULIN</creatorcontrib><creatorcontrib>WANG DONG</creatorcontrib><creatorcontrib>QIN CHAO</creatorcontrib><creatorcontrib>BIAN LIFEI</creatorcontrib><creatorcontrib>TONG WEI</creatorcontrib><creatorcontrib>LU CHAOBAO</creatorcontrib><creatorcontrib>TANG ZHONGJUN</creatorcontrib><creatorcontrib>JIA QI</creatorcontrib><title>Encapsulation shell based on LCP base plate</title><description>The utility model relates to an encapsulation shell based on LCP base plate. The encapsulation shell includes that the metal encloses the frame, sets up and encloses LCP base plate composite bed that the multilayer LCP base plate lamination with anylayer interconnection the frame under formed and the metal attachment on the metal encloses the frame approximately in the metal, the metal encloses frame and the airtight connection of LCP base plate composite bed, metal attachment and metal enclose the airtight connection of frame, LCP base plate composite bed encloses the frame weld layer including die bonding layer, gold wire bonded layer and components and parts and the metal that connects gradually, and the metal encloses the frame weld layer and is provided with the through -hole, realizes that good ground connection and space keep apart, each layer of LCP base plate composite bed is provided with electroplates solid hole, realizes anylayer electrical connection. The utility model discloses a shell has gas t</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNB2zUtOLCguzUksyczPUyjOSM3JUUhKLE5NUQByfZwDwByFAqB8Kg8Da1piTnEqL5TmZlBycw1x9tBNLciPTy0uSExOzUstiXf2MzIwMzK1NDY2CQ01JkoRAHVvKYQ</recordid><startdate>20170616</startdate><enddate>20170616</enddate><creator>LYU JIPING</creator><creator>CHEN YIJUN</creator><creator>HU LIULIN</creator><creator>WANG DONG</creator><creator>QIN CHAO</creator><creator>BIAN LIFEI</creator><creator>TONG WEI</creator><creator>LU CHAOBAO</creator><creator>TANG ZHONGJUN</creator><creator>JIA QI</creator><scope>EVB</scope></search><sort><creationdate>20170616</creationdate><title>Encapsulation shell based on LCP base plate</title><author>LYU JIPING ; CHEN YIJUN ; HU LIULIN ; WANG DONG ; QIN CHAO ; BIAN LIFEI ; TONG WEI ; LU CHAOBAO ; TANG ZHONGJUN ; JIA QI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN206259334UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2017</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>LYU JIPING</creatorcontrib><creatorcontrib>CHEN YIJUN</creatorcontrib><creatorcontrib>HU LIULIN</creatorcontrib><creatorcontrib>WANG DONG</creatorcontrib><creatorcontrib>QIN CHAO</creatorcontrib><creatorcontrib>BIAN LIFEI</creatorcontrib><creatorcontrib>TONG WEI</creatorcontrib><creatorcontrib>LU CHAOBAO</creatorcontrib><creatorcontrib>TANG ZHONGJUN</creatorcontrib><creatorcontrib>JIA QI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LYU JIPING</au><au>CHEN YIJUN</au><au>HU LIULIN</au><au>WANG DONG</au><au>QIN CHAO</au><au>BIAN LIFEI</au><au>TONG WEI</au><au>LU CHAOBAO</au><au>TANG ZHONGJUN</au><au>JIA QI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Encapsulation shell based on LCP base plate</title><date>2017-06-16</date><risdate>2017</risdate><abstract>The utility model relates to an encapsulation shell based on LCP base plate. The encapsulation shell includes that the metal encloses the frame, sets up and encloses LCP base plate composite bed that the multilayer LCP base plate lamination with anylayer interconnection the frame under formed and the metal attachment on the metal encloses the frame approximately in the metal, the metal encloses frame and the airtight connection of LCP base plate composite bed, metal attachment and metal enclose the airtight connection of frame, LCP base plate composite bed encloses the frame weld layer including die bonding layer, gold wire bonded layer and components and parts and the metal that connects gradually, and the metal encloses the frame weld layer and is provided with the through -hole, realizes that good ground connection and space keep apart, each layer of LCP base plate composite bed is provided with electroplates solid hole, realizes anylayer electrical connection. The utility model discloses a shell has gas t</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_CN206259334UU
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Encapsulation shell based on LCP base plate
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-10T06%3A09%3A27IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LYU%20JIPING&rft.date=2017-06-16&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN206259334UU%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true