A high efficiency mainboard cooling system for smart mobile phone
The utility model relates to a high efficiency mainboard cooling system for smart mobile phone, including mainboard, heat -conducting plate, shell and the heat dissipation mechanism that from the bottom up set gradually, the heat -conducting plate includes shield plate, silica -gel plate and graphit...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The utility model relates to a high efficiency mainboard cooling system for smart mobile phone, including mainboard, heat -conducting plate, shell and the heat dissipation mechanism that from the bottom up set gradually, the heat -conducting plate includes shield plate, silica -gel plate and graphite membrane, the shield plate sets up on the mainboard, the graphite membrane sets up the inboard at the shell, the silica -gel plate sets up between shield plate and graphite membrane, heat dissipation mechanism includes a plurality of radiator unit, the even top that sets up at the shell of radiator unit, radiator unit includes fin, the scattered heat exchanger who sets up on the fin top of vertical setting and sets up the double -screw bolt in the fin bottom that this a high efficiency mainboard cooling system for smart mobile phone passes through the good effect of thermal conductivity of heat -conducting plate, has guaranteed to conduct fast the heat of mainboard, has improved cooling system's reliability, not only can carry out quick processing to the heat through the mechanism of dispelling the heat simultaneously, can also change in real time to the radiating efficiency and the practicality of heat dissipation mechanism have been improved. |
---|